PCB Cleaning Medium with a Mild Formulation Especially for Sensitive Metal Alloys VIGON A 250 is a water-based MPC® cleaning agent designed to remove flux residues and solder pastes from electronic assemblies. Due to its mild formulation, VIGON® A 2
VIGON US is a water-based medium specifically developed for the use in ultrasonic, spray-under-immersion and centrifugal cleaning equipment. Based on MPC Technology, VIGON US removes all types of flux residues from electronic assemblies, ceramic hybr
Electronics Forum | Mon Dec 22 16:20:03 EST 2014 | warwolf
Basically the contract comes first, then the design drawings then IPC. if your costumer is asking you to bend the PCB then it becomes apart of the design drawings. as for looking for a cover, get it in writing that that's what they want you to do. I
Industry News | 2011-03-24 12:05:26.0
ZESTRON will raffle 4 free Ion Chromatography services at the IPC APEX Expo 2011 held from Tuesday, April 12th through Thursday, April 14th at the Mandalay Bay Resort & Convention Center in Las Vegas, NV. Each free service will be provided by ZESTRON and includes the analysis of two boards.
Industry News | 2017-02-02 18:53:10.0
ZESTRON is pleased to announce that Ravi Parthasarathy will present “SIR Test Vehicles Comparison from a Cleaning Perspective” during the “S20: Cleanliness/Reliability I” session on Wednesday, February 15th, from 1:30 to 3:00PM.
Technical Library | 2020-05-08 18:22:31.0
A customer contacted the Helpline to perform analysis on a lead-free assembly which exhibited intermittent functionality. The lead-free assembly exhibiting intermittent functionality when pressure was applied to the ball grid array (BGA) packages. Industrial adaptation of a Restriction of Hazardous Substances (RoHS) compliant solder standard has created a new host of failure modes observed in lead-free assemblies. Pad cratering occurs when fractures propagate along the epoxy resin layer on the underside of the BGA connecting pads. While originating from process, design, and end use conditions, it is the combination of a rigid lead-free solder with inflexible printed circuit board (PCB) laminates that has advanced the prevalence of this condition. Pad cratering is simply the result of mechanical stress exceeding material limitations.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Wed Apr 20 08:30:00 EDT 2016 - Wed Apr 20 17:00:00 EDT 2016 | Kista, Sweden
Understanding and Managing Printed Circuit Fabrication: Procurement, Design Advice and Sourcing from Asia with Happy Holden
SMTnet Express, July 13, 2017, Subscribers: 30,584, Companies: 10,624, Users: 23,496 Divergence in Test Results Using IPC Standard SIR and Ionic Contamination Measurements K. Tellefsen, M. Holtzer, T. Cucu, M. Liberatore, M. Schmidt - Alpha
IPC-TM 650 Ionenchromatographie Detaillierte Verteilung der ionischen Kontamination (Anionen, Kationen und und schwache organische Säuren) auf Baugruppen gemäß
2.2.6 & 2.2.7 Bow & Twist Evaulation as per IPC TM-650 2.4.22 Adhesion/Tape Test as per IPC TM-650 2.4.1 Rework Simulation/Unsupported Holes as per IPC TM-650