Electronics Forum | Fri May 27 14:09:19 EDT 2022 | davef
No solder mask; Class 2 => Class T; Class 3 => Class H.
Electronics Forum | Fri May 27 18:43:19 EDT 2022 | SMTA-64387182
Thanks for confirming. Joe
Electronics Forum | Fri May 27 12:34:20 EDT 2022 | SMTA-64387182
On my PCB fab drawings, I specify SOLDER MASK PER ANSI/IPC-SM-840, should I specify a CLASS rating? It appears at one time the CLASSES were 1, 2, or, 3. I believe, they are now T or H. Correct? Thanks, Joe
Electronics Forum | Tue Jan 09 08:36:17 EST 2018 | pavel_murtishev
IPC-SM-840. If overall thickness is not specified in purchasing documents, a supplier will do whatever it wants. Specify your requirements. Typical values are 20-50um. Regards
Electronics Forum | Thu Jan 11 04:23:08 EST 2018 | jaisabaigroup
IPC-SM-840. > > If overall thickness is not > specified in purchasing documents, a supplier > will do whatever it wants. > > Specify your > requirements. Typical values are > 20-50um. > > Regards Thank you very much, Pavel.
Electronics Forum | Thu Mar 05 09:46:12 EST 2009 | davef
Solder mask requirements: * IPC-6012 and IPC-SM-840 contain detailed specifications and information regarding solder mask requirements. * IPC-A-600 defines acceptability of printed boards [analog of A-610 for board assemblies]. Why can't you use A-6
Electronics Forum | Fri Oct 08 18:26:19 EDT 1999 | Dave F
| | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | PCB is FR4 | | Solder Mask is LPI | | Reflow and W/S Profile = Standard | | | | t
Electronics Forum | Fri Oct 08 13:04:15 EDT 1999 | Dave F
| Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | PCB is FR4 | Solder Mask is LPI | Reflow and W/S Profile = Standard | | thanks and rega
Electronics Forum | Tue Feb 27 22:40:28 EST 2007 | davef
IPC-A-600G, 2.9 Solder Resist [Solder Mask] [snip]"Solder resists are used to limit and control the application of solder to selected areas of the printed circuit board during assembly soldering operations and are sometimes used to reduce dendritic f
Electronics Forum | Tue Nov 11 16:30:08 EST 2008 | naynayno
Occasionally solder mask thickness is believed to be the cause of gasketing challenges during paste printing. We currently specific IPC-SM-840 on our fab drawings but this provides no limits or guidelines on thickness. I do not want to cause an unr
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