Electronics Forum: ipc (Page 176 of 282)

Reliability assessment SnPb joints to lead-free component

Electronics Forum | Thu Jun 09 06:15:17 EDT 2005 | Clampron

Joseph, We have all been using lead free components for some time. Many passive already have a Pb free plating and we have not seen catastophic failures on them. From the information I have seen, I think this should be OK (with the exception of BGA'

Your recommendation for Lead Free

Electronics Forum | Tue Jul 12 04:21:29 EDT 2005 | Chris Ong

Hi, Have anyone out there been using Asahi products. My knowledge is limited and I only know it from the http://www.asahisolder.com website. Pls feedback or share your view on the Asahi product. If this product worked better than other even if it h

ESD question

Electronics Forum | Mon Dec 12 18:03:15 EST 2005 | Diane

Yes to be quite frank and stright foward your trash cans and bags do affect ESD. Esd also tends to jump thereore you do not actually have to touch the parts to create electrial overstress to the parts. As was mentioned in a previous posting there a

Micro crack for lead free wave solder

Electronics Forum | Tue Aug 02 22:49:55 EDT 2005 | davef

IPC-A-610D Section 5, shows a variety of photographs of: * Good lead-free solder connections * Lead-free soldering anomalies Hot Tear / Shrink Hole is one such anomaly. This shrinkage effect appears primarily on wave-soldered joints, but can also

Scrap criteria

Electronics Forum | Wed Sep 21 16:23:36 EDT 2005 | 14367

I was going to ask the same question. As was mentioned, it depends on the classification of product. If it's IPC Class 3, with a requirement for high reliability, I'd want the OEM manufacturer to have a defined statement on this issue for more that

MSD Control

Electronics Forum | Thu Sep 22 06:54:14 EDT 2005 | Rob

Hi Gavin, Depends on what MSD class, but in general for the more sensitive parts if they've been opened & not used within the time limit it's rebake, add dessicant & seal. Our distribution side splits them down into more manageable/production size

Solder Volume for Lower Profile PBGA

Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC

The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th

Use of solder paste after taking out from cold storage

Electronics Forum | Fri Nov 18 07:49:48 EST 2005 | Samir Nagheenanajar

I agree that Moonman is a pretentious wannabe in the industry. His site has no relevant information, the only humur in there is a picture of his fat finger pushing a button. Myself and my collegues here thought of making a "fake" consulting company

Rohs

Electronics Forum | Fri Nov 11 19:58:10 EST 2005 | mika

About the progress: http://www.smtnet.com//forums/index.cfm?fuseaction=view_thread&CFApp=1&Thread_ID=9184&#Message36599 RoHS is very complex to deal with and it will take a lot of time and investments to complete. Yet, there is no case in the Europea

Pb % contaminant allowed in Pb/Free Solder

Electronics Forum | Fri Nov 11 08:30:12 EST 2005 | GS

HI all, which is the last "though" about the max Pb % allowed/acceptable into a Pb Free Alloy ? For istance inside : - HASL Process Solder Pot Alloy - Wave Solder Pot Alloy ( 400Kg mass average) - Static Wave Solder Pot Alloy - Etc IPC-J-


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