Electronics Forum | Wed Sep 12 18:11:03 EDT 2001 | davef
First, what on the area array package are you analyzing � * Package cracking? * Cracked solder balls? * Er, what? Second, most failure analysis discussions consider dye penetration to be a non-destructive test, but then again most failure analysis
Electronics Forum | Mon Jan 28 08:07:44 EST 2002 | JohnW
Sorry I keep forgetting you lot are backwards in the old metric system :0) anyhoo, yes IPC, the bastions of right well as long as your board is only 1.6mm thick (sorry 62mils)say that you need 75% min general and 50% on ground planes. I'd like to se
Electronics Forum | Fri Sep 22 16:21:31 EDT 2006 | patrickbruneel
Figure 1. Human Toxicity Potential, Life-cycle Comparison Tin/lead solder paste is the top formula. SAC is second from the bottom.3 RoHS Report Excludes Comparisons By George A. Riley, contributing editor A European Union (EU) Commission for Envir
Electronics Forum | Mon Nov 27 17:44:10 EST 2000 | Dave F
Gawd. Sure FR-4 will meet those conditions. Tg [check the fine SMTnet Archives for discussion on Tg] of FR-4 is 130�F or so. Consider: * Is the delT between Tg and the upper operating [or storage] temperature acceptable for your application? * D
Electronics Forum | Mon Jun 26 20:34:14 EDT 2000 | Dave F
Gary: Allow expand on this topic a bit. Back in the gray skied past when people wore calculators on their belts, rather than pagers n Palms, and didn�t drink California spill, they used HASS that you mentioned and HALT (Highly Accelerated Life Test
Electronics Forum | Fri May 19 11:20:12 EDT 2000 | John Thorup
Dave - well said ScottM - I'm appalled - Your management sounds like a throwback to an early industrial age where the workers were treated as a commodity. It's not right to do only what you're forced to do when protecting human beings and the enviro
Electronics Forum | Tue Jun 17 09:00:58 EDT 2003 | fmonette
Good question, here is the short answer : The problem is that dry storage is not the same as a bake process. If you want to bake saturated components, this should be done at higher temperatures. The IPC/JEDEC standard provides a table with bake temp
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
Electronics Forum | Tue Feb 06 18:19:30 EST 2001 | davef
Now that's surprising that your board fabricator would say the mask was cured properly [without even inspecting the boards]. I wonder if they can backup those BOLD words when testing your boards with the webbing problem. The reason you can�t find t
Electronics Forum | Thu Apr 19 21:49:29 EDT 2001 | davef
SCREENING... 1. Is type 4 paste necessarily required? [No, not unless you are using it for some other purpose.] 2. Is No-Clean Ok to use? [YES] 3. How thin stencil is required? 5 mils? [5 is OK, but I wouldn�t base the decision on the 0201. 6 mil is
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