Electronics Forum: ipc (Page 266 of 282)

Moisture Sensative Components

Electronics Forum | Tue Feb 10 20:40:49 EST 2004 | Kevin McCarten

1st thing to be said; I work for a company that supplies Desiccant Dry cabinets to the electronics industry for the storage of moisture sensitive components. The answer here really lies in inventory management/control. Ultimately you want to avoid b

bulbous joint

Electronics Forum | Fri Feb 20 12:55:43 EST 2004 | russ

Ah, the old contour wave. I don't really know how to adjust those to get correct backflow to reduce your solder volume. I need to ask why you are worried about this. Do you have a QC requirement in excess of IPC class3 wich allows for this joint t

PCBA rework

Electronics Forum | Tue Mar 09 12:13:27 EST 2004 | Gabriele

I want just to confirm what Dave suggested you. J-STD-033a, par 6. Boards Rework tells you plenty of useful informations. 6.1 Component removal, RWK and remount 6.1.1 Removal for Failure Analysi 6.1.2 Removal & Remount 6.2 Baking of Populated Boar

Solder Balls in Boards

Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324

Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,

Evaluating / Qualifying Solder Paste

Electronics Forum | Wed Sep 15 14:06:40 EDT 2004 | frankR.

Hi Rick, Last year I've test about 15 different solder paste. To procede, I've started with different tests listed in different brochure including IPC. At the biginning, I had 15 different tests to do and at the end ( for the last 7 product ) I've

BGA Voids (again)

Electronics Forum | Tue Sep 21 09:49:50 EDT 2004 | Pomponio Magnus

Has anyone ever seen the distributions that result when plotting percent voiding? (Typically a BGA will have enough balls that you can get oogles of data.) I have seen this and seem to be noticing a pattern. First, they are not all normal, so your

SMT PLACEMENT EQUIPMENT

Electronics Forum | Mon Oct 04 14:05:06 EDT 2004 | pjc

Please be careful about responses you get. Opinions run rampant and it is not wise to make a decision on equipment based on opinions of others. For example, you may get five negative replies on a piece of equipment from five incompetent idiots. Certa

BGA & QFP post reflow inspection

Electronics Forum | Wed May 04 17:15:02 EDT 2005 | siverts

Hey Dr . Klein, I think You do it all right... But here it comes: MSD; what does it really means? MS-level; what does it really means? Floor life what does it really means? I'm sorry but I can't answer all these questions right now. It is a complex m

AOI Machines...........

Electronics Forum | Tue Dec 13 07:01:56 EST 2005 | clampron

Good Morning, We are currently using 4 Mirtec machines. We decided on the Mirtec after a side by side evaluation of several tabletop machines. I have to admit that Yestech was not one of them. However, after the evaluation, the Mirtec outperformed t

Can you wave solder this part

Electronics Forum | Tue Aug 22 21:00:39 EDT 2006 | davef

National says: [ http://www.national.com/packaging/llp/faq.html#faq_manu ] Manufacturing FAQ's Are there any precautions that need to be taken with the LLP package? It is critical to follow National�s guidelines for successful surface moun


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