2820 ipc results

Electronics Forum: ipc (Page 51 of 282)

How do you prove IPC-A-610 compliance to a federal agency?

Electronics Forum | Fri Jul 09 14:28:29 EDT 2010 | jamyboy

Wondering if anyone has ever had to prove IPC-a-610 compliance to a Federal Agency (Not DOD)? If so how did you accomplish it and what was the Federal Agency's response after sending Proof of Compliance? Thank you in Advance

IPC J STD 004B Reliability tests

Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22

Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp

IPC/JEDEC standard for solder paste printing defects

Electronics Forum | Wed Mar 23 05:17:23 EDT 2011 | arwankhoiruddin

Hi All. I want to know what is the IPC/JEDEC standard for solder paste printing defects. From the brochures of SPI Machines, the recognized defects are excessive, insufficient, misalignment, no solder, bridging, and solder shape error. What document

IPC/JEDEC standard for solder paste printing defects

Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef

There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g

Dry Packing Desiccant Source

Electronics Forum | Fri Aug 10 13:46:30 EDT 2012 | lrota

I would check the IPC spec IPC-1601 ( Printed Board Handling And Storage Guideline). Also, be sure your dessicant does NOT contain sulphur in either the dessicant material or the paper holding the material. Enthone advises to not use dessicants ins

Solder Paste layer question

Electronics Forum | Sat Dec 01 13:43:51 EST 2012 | anvil1021

Do you mean the Paste Layer of the Gerber files? If so then you can check for aspect and area ratio of the component apertures (which is determined by the thickness of the stencil) there is an IPC specification for this and it is IPC-7525A I believ

Acceptable per J-STD-001 and IPC-A-610 Class 3?

Electronics Forum | Thu May 23 07:50:04 EDT 2013 | icin

The attached images appear to be a result of a touchup process. We believe that this is not a fracture, but more of a condition where the solder touchup process did not completely flow the solder. Is this acceptable per J-STD-001 and IPC-A-610 Class

Can TH component be placed on solder side of Single Side PCB?

Electronics Forum | Wed Jul 17 09:40:33 EDT 2013 | proceng1

I have a CM project that is a single sided pcb (not plated thru holes) and I have 3 axial resistors that the Customer wants placed on the "solder side" of the board. I cannot find an IPC-A-610 reference to putting parts on the wrong side of a single

Can TH component be placed on solder side of Single Side PCB?

Electronics Forum | Wed Jul 17 12:38:50 EDT 2013 | horchak

It's what the customer wants. remember the customer is always right and that IPC is only recommended guidelines the last time I looked. I also belive IPC shows examples of PTH parts being preped and lap soldered to SMT pads so common sense says what'

IPC J-STD-001E Ionic Cleanliness Standard

Electronics Forum | Thu Sep 05 22:36:38 EDT 2013 | davef

Yes, providing your: * Inbound material does not compromise your process. * Soldering processes apply the proper amount of flux and activate it properly * Material handling does not contaminate your boards Recognize that the IPC requirements of less