2820 ipc results

Electronics Forum: ipc (Page 86 of 282)

Temp. Specs on SMT parts

Electronics Forum | Mon Nov 29 18:54:30 EST 2004 | russ

IPC 782 has some info in it by package type. This is usually dictated by each component manufacturer. All SMT parts should be able to withstand 220 C for at least 60 sec. Russ

What is a CHAMPAGNE Voiding?

Electronics Forum | Fri Dec 03 12:27:41 EST 2004 | mruzicka

I did a quick search and ran across this: www.nepcon.co.uk/files/pt_kbryant.pdf You can also look here http://listserv.ipc.org/scripts/wa.exe?A1=ind0411&L=technet post #32.

need IPC standards for lead free solder joint reliability tests

Electronics Forum | Thu Dec 09 17:45:27 EST 2004 | davef

You're correct. There is no criteria for no-lead, but there none for SnPb, either. Solder joint strength in pull/shear will vary with lead geometry, solder volume, lead metal/metallization, the way the test is done.

SMT Part Number Standards

Electronics Forum | Thu Dec 09 17:34:27 EST 2004 | Charles Brown

I'm looking for an industry standard for naming of surface mounted devices. What does the everyone use? ex. IPC-SM-1206-06 Is this and acceptable convention?

ESD

Electronics Forum | Fri Dec 10 13:54:49 EST 2004 | greg

Hallo I am going to prepare our SMT and THT production to meet ESD protection. Could you please point some information theoretical and practical about ESD. Any web site, documentations which is important (standards-IPC), really worth books will

What is to much Void?

Electronics Forum | Mon Dec 13 14:41:41 EST 2004 | DasonC

Check IPC-7095, 7.4.1.6 For Class 2, 45% of the diameter adn 20.25% for the area.

Your opinion about RoHS and WEEE ?

Electronics Forum | Wed Dec 15 12:47:59 EST 2004 | DasonC

Recommend to check http://leadfree.ipc.org I agreed the lead free is a must for environmental and human health. Not sure how soon they can found out another harmful material

Storage Conditions

Electronics Forum | Wed Dec 15 18:09:10 EST 2004 | DasonC

Jedec J-STD-033A for components. For the Fab and assy, you can check IPC-PE-740, Para. 1.5.4

Pre-bake of Polyimide flex ? ?

Electronics Forum | Wed Dec 22 21:14:53 EST 2004 | davef

IPC-FA-251 recommends 121*C for 30-60 minutes for 1 and 2 flex layer circuits. A rigid flex can take easily an hour per layer depending on the construction.

enig

Electronics Forum | Sat Oct 15 15:57:11 EDT 2005 | GS

Organic Solderability Preservative, is a definition that you can find, for istance, on IPC-2221A (geneiric standard on printed board design) Tabel 4-3 (Final Finisch, etc) Regards............GS