Electronics Forum | Wed Jun 07 09:26:09 EDT 2006 | amol_kane
can you also please tell us the section in IPC-610?...is this in RevD? also, does this also give the solder volume for BGAs? Thanks, Amol
Electronics Forum | Mon Jun 12 10:46:38 EDT 2006 | Chunks
It's hard to believe MoonMan spends this much time typing these rants. Guess the boys at ever so much higher I.Q. standard of engineering, IPC, kicked him out there too.
Electronics Forum | Mon Jun 12 14:33:40 EDT 2006 | pjc
IPC spec is V-score shall not be more than 1/2 board thickness. They should be V scoring 1/4 off top and 1/4 off bottom equally.
Electronics Forum | Tue Jun 13 08:33:11 EDT 2006 | davef
IPC-2222, 5.3.1 defines the parameters of making scoring cuts and the tolerance of the cuts, but does not specify the cuts. Our spec for 0.062" thick FR-4 boards is: 0.018-0.024"
Electronics Forum | Tue Jul 25 08:46:50 EDT 2006 | GS
Hello all, I need to learn about Conductive Anodic Filament (CAF). All information about the phenomenon will be appreciated. About IPC TM-650 6-2-25 CAF Resistance Test, where could it be performed in European Lab ? Thanks in advance Regards....
Electronics Forum | Thu Aug 17 15:26:49 EDT 2006 | Chunks
Well, you won't win any IPC awards for doing this. Another idea is to use a center punch to create the dimple you need. It wouls be quicker and you won't destroy the barrel like you will with a drill. Don't ask me how I know.
Electronics Forum | Sun Sep 17 02:48:41 EDT 2006 | Eric
Anyone know any international standard (e.g. IPC, JIS) for the SAC lead free solder strength ? If no, any industrial / company standard for it ? Besides, any mathematical model which can help to calculate it.... express in "Force / area "
Electronics Forum | Mon Sep 18 11:30:43 EDT 2006 | aj
Hi All, What is the difference between the above? Came across some conflicting design rules between the two - in particular 0402 smt footprint. aj...
Electronics Forum | Mon Sep 25 11:43:56 EDT 2006 | mrduckmann2000
HELP, I AM SEEKING THE PROPER CANDLE POWER FOR A SHOP FLOOR THAT IS WORKING TO IPC-610 CLASS II AND III STANDARDS. ANYONE KNOW WHAT THE MIN AND MAX SHOULD BE??? THANKS FOR THE HELP!
Electronics Forum | Tue Oct 17 15:31:29 EDT 2006 | TM
I've got some MELF packages that reflow and connect but later fall out of the solder pretty easily. We are not using epoxy but, the parts have fillets per IPC standards. We have not looked at cross-sectioning for IMC and don't plan to at the moment
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