Electronics Forum | Tue Apr 08 12:38:12 EDT 2003 | Denise
I'm looking for comparison data on MTBF for solder joints meeting IPC Class II vs Class III.
Electronics Forum | Wed Apr 09 09:36:18 EDT 2003 | iman
what r your test running parameters? what end-application?
Electronics Forum | Wed Apr 09 14:09:54 EDT 2003 | davef
MA/NY DDave, I'll take your money. I'm betting on the Class II, whatever that is, because: * Solder is the same. * Board is the same from a fabrication and probably materials standpoint. * Components are the same. * Processing is the same. ... but
Electronics Forum | Wed Apr 09 12:18:37 EDT 2003 | MA/NY DDave
Hi This is an excellent question or research project. I would call the IPC and find out if anyone has already done this work. My guess is that Class III should be slightly better, yet considering the application difference where Class III is used
Electronics Forum | Thu Apr 10 15:20:35 EDT 2003 | MA/NY DDave
Hi DaveyF, Thanks You see, you proved my point, with piles of more information than I gave. Based on Application rather than design and manufacturing specifications, a lower IPC class can out perform another. So our starting Poster must look at t
Electronics Forum | Fri Sep 23 15:10:45 EDT 2011 | action_101
The IPC-610 class II spec is very reasonable. If they expect class 3 then make them pay for it....IMO
Electronics Forum | Wed Feb 02 21:56:11 EST 2005 | davef
Based on X-ray imaging, IPC-7095 standard specifies three categories for void size for BGA solder joints. These categories are based on the percentage of joint cross sectional area occupied by the voided area. Class III Small: Void area is LT 9% Cla
Electronics Forum | Fri Sep 23 16:39:00 EDT 2011 | action_101
The small investemnt of purchasing the IPC-610 manual will pay for itself very quickly. A brief description of the two classes in a few words would be the following: Class II - a well built product with reasonable expectations for both the manufactur
Electronics Forum | Tue Apr 08 16:03:29 EDT 2003 | jonfox
MTBF is hard to nail down raw data based on whether or not it is classified as IPC CII or CIII alone. Given that most failures are environmentally based, you might be able to get this data for CII and CIII in similar environmental testing situations
Electronics Forum | Mon Sep 26 12:58:33 EDT 2011 | action_101
So you are saying that building to class III is going to prevent failures? I disagree. Class III is trying to hit target condition in every aspect of the production of the circuit board. That my friend does not ensure failures from happening. I see
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