Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman
Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.
Electronics Forum | Sun Aug 03 08:27:41 EDT 2008 | davef
IPC-4553, Specification for Immersion Silver Plating for Printed Circuit Boards, 1.4.1 Solderability. This primary function of IAg is to provide a solderable surface finish, suitable for all surface mount and through-hole assembly applications and wi
Electronics Forum | Thu Jan 22 20:14:44 EST 2009 | herman
If you wish to specify ENIG, your best method of doing it is to simply invoke IPC-4552 (or IPC-4553 for immersion silver) on the fabrication drawing. These IPC standards define ENIG and IAg, and I believe they specify 150-180 uinches of nickel covere
Electronics Forum | Sat Feb 16 07:21:17 EST 2019 | SMTA-Joe
I am experiencing a "tarnishing" issue on PWB traces that may be causing problems with component reflow. The PWB traces are made to the following spec: SOLDER MASK OVER BARE COPPPER WITH SILVER IMMERSION PLATING PER IPC4553, PLATING TO BE 8-12 MIC
Electronics Forum | Sat Aug 30 11:42:49 EDT 2008 | davef
Some immersion silver [IAg] products can go brown with aging. On a newly plated board, we expect you to see Ag, C, & O. The amount will vary according to supplier and thickness. Questions are: * How uniform is the brown coloration of the IAg on the
Electronics Forum | Wed Feb 22 08:31:42 EST 2006 | davef
Q1 Are there any standard regulating the subject? Very few infos found on IPC. A1 We�re unaware of standards for packing and storage for most types of boards. * IPC 4553 standard for Immersion Silver Finish, 3.8 Packing and Storage. * J-STD-033 and E
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