Electronics Forum | Wed Dec 15 12:41:49 EST 2004 | DasonC
Check IPC-A-610C Chapter 12.1, Staking Adhesive
Electronics Forum | Fri Oct 13 08:09:41 EDT 2017 | davef
While I wouldn't be happy with this "Hershey's Kiss" appearing solder connection, I'd suck it up and and accept it as acceptable according to IPC-A-610F, Section 5.1
Electronics Forum | Thu Oct 12 09:20:22 EDT 2017 | stefan110882
Hello everyone, I would like to know how you interpret the wetting angle in chapter 5. What is meant with: "...solder contour extending over the edge of the solderable termination area or solder mask..." Thanks ps I know what a solder mask is.
Electronics Forum | Thu Oct 12 13:20:45 EDT 2017 | stefan110882
Thank you very much for your response.I would like to know in which cases this could be the case. We have a disagreement how to interpret this and I need a 3rd opinion. Thank you very much for your help!
Electronics Forum | Thu Oct 12 21:12:01 EDT 2017 | davef
Please post some pictures so we can see what you're talking about.
Electronics Forum | Thu Oct 12 13:15:37 EDT 2017 | davef
It is the two conditions pictured in IPC-A-610F, Figure 5-1 C, D. In the old, simplier days, we wanted our solder connection to have: * Low wetting angle * Shiny metal Today, the metal doesn't have to be shiny and the wetting angle can be a high
Electronics Forum | Wed Mar 24 15:10:23 EST 2004 | davef
Without a proper picture, I'd reject the parts that you describe based on IPC-A-610, 7.2, which says words to the effect: Defect - Class 1,2,3 - Dirt and particulate matter on assembly, eg, dirt, lint, dross, metallic particles, etc. Absence or pres
Electronics Forum | Thu Oct 12 22:36:40 EDT 2017 | stefan110882
Please ost some pictures so we can see what > you're talking about. OK here an example. I'm sorry for the bad quality - The picture is cropped and only one of two pictures that I had on the phone that I could use. According to my supervisor, th
Electronics Forum | Tue Mar 26 23:26:35 EST 2002 | ianchan
Hi Guys, (Note: We are not talking about bill-board RES/CAP, we are talking about Z-axis slant/tilted RES/CAP with respect to the PCB pad Z-axis plane). 1) We ref through the IPC-A-610C specification "bible", and can not find a "chapter/verse" tha
Electronics Forum | Thu Mar 23 22:26:53 EST 2006 | Joseph
Dear all, Referring comment from Mr. Jack,IPC director certification & assembly technology, the term "fillet tearing" is too broad. Cracks or fractures in the required fillet area, with SnPb or LF alloy and whether you call it tearing or not, is a D
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