Electronics Forum: ipc a-610 (Page 1 of 24)

IPC-A-610D Question

Electronics Forum | Wed May 03 15:45:44 EDT 2006 | Tim

Brett, I've found out that it is not a defect with respect to Rev. D. You are correct about the thermal expansion but due to the size of the plastic SOIC's and SOT's they have eliminated it as a defect. Thanks, Tim

IPC-A-610D Question

Electronics Forum | Tue May 02 16:37:57 EDT 2006 | bhall

I have experienced the exact same problem with excess solder touching the plastic component body. The solution in my case was simply to replace the stencil. I was using a reusable stencil frame that had been worn out. I replaced the stencil with a so

IPC-A-610D Question

Electronics Forum | Tue May 02 14:56:57 EDT 2006 | Tim Flat Ribbon, L, and Gull Wing Leads, Maximum Heel Fillet Height (E). For class 3 the heel fillet cannot touch the body of a plastic component, except for SOICs and SOTs. Why is my question? What type of failure will be the result of solder

Becoming an IPC-A-610 Class 3 supplier

Electronics Forum | Tue May 27 16:42:01 EDT 2003 | markhoch

I've been tasked with finding out how difficult it would be to convert our company from a Class 2 to a Class 3 supplier. Does anybody know if there is a "how to" manual available to assist me in getting this done. Short of going thru all of IPC-A-610

Becoming an IPC-A-610 Class 3 supplier

Electronics Forum | Tue May 27 17:09:46 EDT 2003 | davef

J-STD-001C, Table 11-1 is a good starting point.

IPC-A-610 and IPC J-STD-001 Updations

Electronics Forum | Mon Jul 24 07:18:51 EDT 2017 | jamesbarnhart

IPC has updated assembly standards for IPC A-610 and IPC JSTD-001 making them easier to use and adding information in areas that have evolved. Both IPC J-STD-001E and IPC-A-610E have also been more closely linked to eliminating the differences that c

IPC-A-610 and IPC J-STD-001 Updations

Electronics Forum | Mon Jul 24 09:15:32 EDT 2017 | davef

James: This is not "breaking news." IPC-A-610F, Acceptability of Electronic Assemblies was released in July 2014. Both, ... * IPC-A-610G, Acceptability of Electronic Assemblies * J-STD-001G, Requirements for Soldered Electrical and Electronic Assem

CSP assembly compliance to IPC-A-610 minimum electrical clearance

Electronics Forum | Wed Sep 12 03:52:45 EDT 2018 | shascoet29

Hi, Is the IPC-A-610 applicable to CSP assemblies? Especially regarding the solder ball to solder ball distance versus the minimum electrical clearance for assembly(0.13mm/IPC-A-610). With a 0.4mm pitch component and 260 microns diameters balls, thi

IPC A-610 Moving from Rev E to Rev F

Electronics Forum | Wed Jun 28 07:31:48 EDT 2017 | jamesbarnhart

The IPC A-610 is the most widely utilized inspection standard for electronic assemblies is now updated. It is now moved at Revision F and there are things many new things we need to know about this. Plz explain in detail the major updation in this mo

IPC-A-610 interpretation of wetting angle (Chapter5)

Electronics Forum | Fri Oct 13 08:09:41 EDT 2017 | davef

While I wouldn't be happy with this "Hershey's Kiss" appearing solder connection, I'd suck it up and and accept it as acceptable according to IPC-A-610F, Section 5.1

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