Electronics Forum: ipc and 610 and warp (Page 1 of 5)

warp and twist

Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef

Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and

warp and twist

Electronics Forum | Mon Feb 13 23:05:02 EST 2017 | swestheimer

I have been asked a very good question but have not been able to find a good answer. IPC for both PCB and PCBA refer to the X & Y dimensions to measure warp and twist but how would you determine the warp and twist for a round PCB or PCBA?

IPC 610 and J-STD Rev D - What's it all About?

Electronics Forum | Thu Mar 03 16:33:24 EST 2005 | pjc

Revision D has over 730 new and updated illustrations of acceptability criteria and has been critically reviewed for clarity and accuracy. The document synchronizes to the requirements expressed in other industry consensus documents and is used with

IPC 610 and J-STD Rev D - What's it all About?

Electronics Forum | Thu Mar 03 16:41:11 EST 2005 | davef

According to an on-line posting ... SMTA On-line Presentation Comparing Industry Standard Revisions March 9: IPC-A-610 with Regards to Lead-free Technology There have been extensive and significant changes to the industry standard IPC-A-610 with th

IPC 610 and J-STD Rev D - What's it all About?

Electronics Forum | Thu Mar 03 11:00:04 EST 2005 | PeteP

In a nutshell, what are the Rev D changes to the standards? What re-certification requirements are in place?

Standard of PCB Bow and Twist in Incoming Inspecion

Electronics Forum | Fri Feb 28 09:08:03 EST 2003 | davef

Without drilling through the numbers, they're probably correct. Recognize that standard warp / twist specs [IPC-A-610 1.5% for PTH only and 0.75% for SMT] are not going to make it on tech boards. You need to define specific requirements. This warp

QFN's and LGA's

Electronics Forum | Wed May 20 17:56:51 EDT 2009 | dyoungquist

I have attached a pdf showing the dimensions for the QFN we placed. First, The pins on the part are not only on the bottom side but also wrap around to come up each of the 4 sides of the part as shown in the side view in the attached pdf. This i

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

Material Ageing and Storage

Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL

SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed

SMT Processing and gasketing

Electronics Forum | Tue Nov 11 17:35:08 EST 2008 | davef

SM-840, is a material qualification document only, with all the test requirements applicable only to a defined test coupon, not to production boards. So, it's useless for what you're trying to accomplish. As assemblers use A-610 - Acceptability Of E

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