4 ipc and stards and tin and lead results

Electronics Forum: ipc and stards and tin and lead (Page 1 of 1)

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 11:55:08 EST 2007 | chef

I recently had the same problems, solder bridges on every thing I made, different customers boards, etc. I wave with no-clean flux. As I sorted out problems (pin holes, blow holes, splatter, etc.) I found a lot of variable factors. I changed flux,

Re: Shear strength and Copper/Tin Intermetalic layer

Electronics Forum | Thu Jul 09 21:04:50 EDT 1998 | Dave F

| Hi there, | I am looking for some informations concerning the shear or pull strength of a typical TQFP 20 mils leads in relationship with the Copper/Tin intermetalic layer thickness. Could anyone help? | | Thank in advandce. | rgs, | chiakl Chiakl

SMT termination visual and solderability issues.

Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling

CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function

Criteria for Min Thickness regarding Large and Small pads

Electronics Forum | Mon Jun 30 08:55:31 EDT 2008 | davef

It will be tough to find a dimensional thickness specification for HASL. IPC-6012 Table 3-2, line "Fused tin-lead or solder coat - Coverage and Solderable" states the requirement that there has to be complete coverage of solder on the land, and it mu