Electronics Forum | Sat Jun 21 23:15:07 EDT 2008 | mika
Also keep in mind that the CCGA column length tolerance is at minimum +/- 0.13mm from most part manufactures and they don't collapse in the same way as a BGA, therefore the paste height deposit could be critical in some rare circumstances. Board warp
Electronics Forum | Fri Sep 29 13:51:46 EDT 2000 | C. Ortner
We work in a "low" volume high reliability house building mixed tech double sided multi layer CCA's for long lived space applications. Our present problem is inspection questioning every dimple/anomaly on every leadless part(we put passives only thr
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Fri Dec 09 13:32:14 EST 2005 | jbrower
Hi Ajay, Does your company currently use any quality standards or is it made up as one goes by the QA department? You might find that using IPC 610A Acceptability of Electronic Assemblies very usefull. This manual is our base line for acceptable or
Electronics Forum | Mon Nov 18 04:04:43 EST 2019 | ramesh_10377
hi initially, as per PCB design and gerber file of PCB we got 5 mil stencil, during process observed lot of solder balls (70-80%), then we decided to go for 4 mil stencil with c-cut. now the problem is reduced and still solderball exists which is a
Electronics Forum | Mon May 15 20:10:27 EDT 2000 | Dave F
David: How about starting with MCMs? IPC docs are: * 2225 - Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies * DD-135 - Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip
Electronics Forum | Wed Mar 27 04:32:49 EDT 2019 | pavel_murtishev
Charliem, Thank you for the input. Following this logic, in case if there are no soldering issues, pad coverage and voiding levels are within acceptable limits and a gap between BTC and pad let us say 200um, this could be accepted, right? IPC-A-61
Electronics Forum | Fri Mar 25 06:03:40 EDT 2011 | arwankhoiruddin
Thank you for the reply, Davef. I am thinking if I can get the standard rather than "trial and error". If there is no such standard, is there any experience of what is the range for good and acceptable solder paste (e.g. minimum and maximum percenta
Electronics Forum | Tue Jun 12 10:13:10 EDT 2001 | techment
Thank you, Mr Dave. Specifically, there are tiny balls spreading on the boards ( on top of solder resists, and not encapsulated). They are not near to any land/pad or connector. I do not think they post any electrical problem. They are quite far away
Electronics Forum | Wed Mar 01 16:58:03 EST 2000 | Dave F
Robert: On your balls: Solder suppliers make several "standard balls" and can advise you. On your cleaner: Recycling water / direct to drain? Most batch cleaner suppliers can advise you on recycling and filtering systems to keep you out of troub
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