Electronics Forum: ipc-610 and fingerprint (Page 1 of 2)

QFN's and LGA's

Electronics Forum | Tue May 26 14:39:40 EDT 2009 | boloxis

QFN or MLFs are mainstream now, QFNs already evloved to much more complex versions now like matrix pins, stacked dice and flipchip versions. IPC 610D already includes them, just make sure the pins have solder plating, the PWB pads have soldermask in

Info/Papers correlating lead protrusion and reliability

Electronics Forum | Wed Mar 16 18:39:55 EST 2005 | KT

I am looking for the same. IPC 610D does mention about the solder fill based on the class (A,B,C). But, there is no exhaustive study that I have come across. Please let me know if you find any. KT

PCB assembly bow and twist

Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo

Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.

Any different between Flat Ribbon and Gull Wing Component?

Electronics Forum | Thu Apr 12 13:23:18 EDT 2007 | slthomas

On the contrary, IPC-610 refers to flat ribbon leads in the same context as gullwing and "L" leads. I've always assumed that they were one in the same (could be wrong here...certainly wouldn't be anything new) and have never seen L or flat ribbon r

ICT and specifying PCBA testing

Electronics Forum | Tue Mar 23 07:35:42 EDT 2010 | jooh

Since I'm new to the forum I probably ask previously answered questions (that I have not found) but I would be grateful if someone could clarify this for me. I'm in R&D at a company where we design low volume (1k-10k) fairly complex PCBAs for our pr

"Gap" in completed solder joint between lead and pad

Electronics Forum | Wed Nov 29 11:46:57 EST 2006 | slthomas

IPC 610 *C* states that the solder thickness requirement is a properly wetted termination is evident. Fillet height is another aspect and is usually specific to the package but is some function of solder thickness plus a percentage of lead height. D

Clearance between Through hole and chip component

Electronics Forum | Wed Feb 28 00:01:47 EST 2007 | Muhammad Haris

Hi, The distance between the two terminations/endings/pads of 0603 (0201)is 0.15mm i.e. lesser than than the distance between the 0603 and through hole i.e. 0.5mm My ques is that, then why its termination doesnot short as it has a minimum distance.A

Lead Free and Leaded Process Mix

Electronics Forum | Mon Jun 27 09:09:19 EDT 2005 | Bob R.

We've all been soldering Pb free parts for a couple decades. All your surface mount capacitors have probably had a Sn finish for years. Whenever one of our parts with a SnPb finish converts for Pb free we have the manufacturing site do a small buil

Pin Hole/Blow Hole - Causes and cure please

Electronics Forum | Thu Jun 24 04:38:31 EDT 1999 | Vinesh Gandhi

Recently, there has been an upsurge in the Pin Hole/Blow Hole problem in our wave soldering process. We are baking the PCBs for 2 Hrs. at 125 degree C. The Wave Soldering profile seems to be O.K. Still the problem is persistent. Can somebody help

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 15:10:50 EST 2006 | M. Sanders

Unfortunately, I don't have a copy of IPC-A-610 D on hand, however, I believe in IPC-610, this �floating height� between lead and pad has no maximum specification restriction. As long as there is no voiding, it is still acceptable for all 3 classes.

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