Electronics Forum | Tue Dec 05 10:35:39 EST 2000 | Gil Zweig
See IPC-7095, "Design and Assembly Process Implementation for BGAs"
Electronics Forum | Wed Feb 02 19:45:09 EST 2005 | ybt
try refering IPC-7095 Design and Assembly Process Implementatin for BGAs. I hope it helps.
Electronics Forum | Thu Jan 24 22:59:06 EST 2008 | dragonslong
Hey....is there really no people who can advise me?
Electronics Forum | Mon Jan 22 20:54:55 EST 2001 | davef
IPC-7095 - Design & Assembly Process Implementation for BGA's Implementing Ball Grid Array (BGA) and Fine-Pitch Ball Grid Array (FBGA) technology presents some unique challenges for design, assembly, inspection and repair personnel. This document
Electronics Forum | Mon Apr 02 17:20:33 EDT 2001 | kward
Try IPC-7095 at ipc.org. It is a complete reference on Design and Assembly Process Implementation for BGAs. Glenbrook Technologies was instrumental in the developemnt of this document
Electronics Forum | Thu Dec 07 11:28:49 EST 2000 | Dason C
I hear that IPC-7095, Design and Assembly Process Implemenatation for BGAs had already release, but I am not able to find at IPC web site. Rgds. Dason
Electronics Forum | Thu Dec 07 11:30:11 EST 2000 | Dason C
I hear that IPC-7095, Design and Assembly Process Implemenatation for BGAs had already release, but I am not able to find at IPC web site. Rgds. Dason
Electronics Forum | Thu Dec 07 12:36:54 EST 2000 | LarryK
Dason is correct, the IPC-7095 is out. Just got my copy, seemed to be a very good book. Larry
Electronics Forum | Mon Apr 02 17:16:22 EDT 2001 | kward
Try IPC-7095. It is not free , but discusses in-depth Design and Assembly Process implementation for BGAs. Website is ipc.org
Electronics Forum | Mon Jan 12 18:06:38 EST 2004 | Kris
Hi, Is there any standard for voids in a leaded device or a chip component ? IPC 7095 lists maximum allowable voiding for BGA devices but has no information on leaded devices Appreciate your help- thanks
