Electronics Forum: ipc-a-600f (Page 1 of 1)

PCB Acceptance Standards

Electronics Forum | Tue Apr 03 13:27:58 EDT 2001 | mparker

go to http:\www.ipc.org. get the following standards: IPC-A-600F Also look at the IPC-6010 series, this may help with your design group. Finally, consider getting IPC-SM-782 and IPC-7525. These are for Surface Mount Design & Land Pattern Standards

Bow and twist of PCB's

Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens

Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,

PWB Pad Finish & dewetting

Electronics Forum | Thu Dec 06 19:46:08 EST 2001 | davef

First, we�re assuming that we�re talking hot air solder leveled [HASL] bare boards, eh? Consider using A-600 - Acceptability of Printed Boards as the basis for discussing the bare board problems. It is the bare board analog of A-610 - Acceptability

Conformal Coating High Power Electronics PCBs

Electronics Forum | Wed Jul 24 09:50:20 EDT 2019 | amitthepcbguy

To perform conformal coating of PCBs in high power electronics applications follow IPC-A-600F and IPC-CC-830B conformal coating standards. This standard enlists several performance criteria. Additionally, this standard is considered as a good referen

Bow and twist of PCB's

Electronics Forum | Fri Apr 20 05:32:39 EDT 2001 | dougie

Hi, I've just splashed out �60 on IPC-A-600F trying to find out the formula for measuring the bow and twist of raw PCB's. Much to my dismay there are 10 lines on the subject in the whole standard. Worse still is that it tells me nothing I don't alre

PCB Surface Question - Picture attached

Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef

You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam


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