Electronics Forum: ipc-a-610d (Page 1 of 3)

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Tue Apr 10 20:54:09 EDT 2007 | raychamp007

Dear Friend, Can any one explain what is 'toe down configuration' stated in 8.2.5.6 IPC-A-610D? Can any one here to explain in more details. Thanks

"Gap" in completed solder joint between lead and pad

Electronics Forum | Tue Nov 28 09:37:39 EST 2006 | GS

Have you seen IPC-A-610 D ? regards GS

IPC Standard for mechanical Hardware

Electronics Forum | Tue Apr 24 21:27:43 EDT 2007 | davef

IPC-A-610D, 6.2.2 Swaged Hardware � Flared Flange

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Thu Apr 12 01:35:13 EDT 2007 | Haris

IPC-A-610D is a Acceptability of the Electronic assemblies so all your questions depends on the product classes either 1,2,or 3 and it is given in this standard about the acceptablity criteria of the soldering of any type of the components i.e. it h

pcb physical handling

Electronics Forum | Wed May 04 10:15:41 EDT 2005 | davef

Here's the index for A-610D: http://www.ipc.org/TOC/IPC-A-610D.pdf

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Wed Apr 11 08:36:23 EDT 2007 | davef

IPC-A-610D refers to 'toe down configuration' several times, beyond the 8.2.5.6 that you question. Although none will add to your understanding of 'toe down'. A lead that is 'toe down' is one where the foot of the lead is not parallel to the pad. T

Conformal coating to avoid oil leak from circuit board

Electronics Forum | Sun Nov 10 15:36:06 EST 2013 | davef

Assuming your conformal coating material was selected with the intent of living a life in contact with oil, why doesn't your coating meet the IPC-A-610D requirement of that there be no voiding, no breaks in the surface, no loss of adhesion, etc? Furt

IPC

Electronics Forum | Thu Nov 10 11:39:51 EST 2005 | Adam

HI Is there Industry Consensus Document , which is an equivalent of the IPC-A-610D : Acceptability of Electronic Assemblies for "Mechanical Assemblies" ? THANKS ADAM

IPC-A-610D Question

Electronics Forum | Wed May 03 15:45:44 EDT 2006 | Tim

Brett, I've found out that it is not a defect with respect to Rev. D. You are correct about the thermal expansion but due to the size of the plastic SOIC's and SOT's they have eliminated it as a defect. Thanks, Tim

What is 'toe down configuration' 8.2.5.6 IPC-A-610D?

Electronics Forum | Thu Apr 12 08:16:19 EDT 2007 | davef

Toe down solution: * Land pattern design * Solder stencil design * Proper component fabrication Normal gull wing lead solder requirement: Solder must extend to the mid-point of the outside of the lead bend.

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