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very wide reflow oven

http://www.hellerindustries.com/search.php?zoom_query=very+wide+reflow+oven&zoom_page=27&zoom_per_page=10&zoom_and=0&zoom_sort=1

. 254 results found containing some search terms. Sort by relevance / Sorted by date ▼ Heller Industries helps kick off the IPC / Apex China 2014 ) Have a Special Application? Configure Your Oven Schedule an Online Presentation About Heller Industries, Inc. Newsroom Heller Industries helps kick off the IPC/ Apex China 2014 Heller Industries helps kick off the IPC/ Apex China 2014 02 Jan 2014 The show is now co-sponsored ... IPC and the HKPCA and was a huge success! Over 36,000 people attended and Apex is now the largest Electronics show in China in terms of square footage . Incoming IPC Board of Directors Chairman Marc Peo of Heller Industries delivers keynote speech at the IPC/Apex China show in December :+ 41-44-840-5858, Fax:+ 41-44-840-5864 ... Beat Fontana, Andre Koller Company About Heller Industries Corporate Responsibility News Events Publications Videos Awards Mentoring Ask The Experts Environment Information Request Representative

OVEN 1809EXL

http://www.hellerindustries.com/search.php?zoom_query=OVEN+1809EXL&zoom_page=24&zoom_per_page=10&zoom_and=0&zoom_sort=0

: Productronica 2017 November 14- 17, 2017| Hall A2 Booth 461| Munich, Germany IPC APEX EXPO 2018 February 27- March 1, 2018| Booth TBD| San Diego, CA, USA Company About Heller Industries Corporate Responsibility News Events Publications Videos Awards Mentoring Ask The Experts Environment Information Request Representative Network :+ 41-44-840-5858, Fax:+ 41-44-840-5864, Beat Fontana, Andre Koller Company About Heller Industries Corporate Responsibility News Events Publications Videos Awards Mentoring Ask The Experts Environment Information Request -switzerland.php Heller Industries helps kick off the IPC / Apex China 2014 ... Reflow Soldering Dual Lane/ Dual Temperature Curing& Back-end Semiconductor Voidless/ Vacuum Fluxless/ Formic Acid Soldering Pressure Curing Ovens (PCO ) Have a Special Application? Configure Your Oven Schedule an Online Presentation About Heller Industries, Inc. Newsroom Heller Industries helps kick off the IPC/ Apex China 2014 Heller Industries helps kick off the IPC/ Apex China 2014 02 Jan 2014 The show is now co-sponsored between IPC and the HKPCA and was a huge success ! Over 36,000 people attended and Apex is now the largest Electronics show in China in terms of square footage. Incoming IPC Board of Directors Chairman Marc Peo of Heller Industries delivers keynote speech at the IPC/Apex China show in December

ABM10 - Abracon - Free Library Parts

https://www.pcblibraries.com/pod/default.asp?WP=168&M=ABRACON&PN=ABM10&PS=5

& Webinars ABM10 - Footprints & 3D Models with Customizable Preferences 2 MILLION+ intelligent footprints & 3D models , easily customizable with your preferences - or simply use the IPC or manufacturer defaults " (2,203 Total Parts Found)   (Showing 836 - 840)   (Page 168 of 441) Search    Register    Log In         Buy POD Credits Manufacturer !    This part must be ordered (5 - 7 POD Credits) - turnaround is typically 1 business day. <<      165   166   167   168   169   170   171        >> (Showing 836 - 840 of 2,203

ABM11 - Abracon - Free Library Parts

https://www.pcblibraries.com/pod/default.asp?WP=168&M=ABRACON&PN=ABM11&PS=5

& Webinars ABM11 - Footprints & 3D Models with Customizable Preferences 2 MILLION+ intelligent footprints & 3D models , easily customizable with your preferences - or simply use the IPC or manufacturer defaults " (1,510 Total Parts Found)   (Showing 836 - 840)   (Page 168 of 302) Search    Register    Log In         Buy POD Credits Manufacturer !    This part must be ordered (5 - 7 POD Credits) - turnaround is typically 1 business day. <<      165   166   167   168   169   170   171        >> (Showing 836 - 840 of 1,510

Instructor Compnent Series Courses - Blackfox.com

https://www.blackfox.com/blackfox-courses/instructor/component-series/

Instructor Compnent Series Courses - Blackfox.com Phone: (888) 837-9959 | [email protected] Store | Home | EN ES Course Calendar Course Calendar 2020 IPC Certification IPC Instructor IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT Recertification IPC 7711/7721 CIT IPC 7711 /7721 CIT Recertification IPC/WHMA A-600 CIT IPC/WHMA A-600 CIT Recertification IPC/WHMA A-620 CIT IPC/WHMA A-620 CIT Recertification IPC/WHMA A-620 with HANDS-ON CIT IPC/WHMA-A-620 Space Addendum IPC J-STD-001 CIT with Space IPC J-STD-001 CIT Space ADD-ON IPC 6012 CIT En Español IPC Standards Expert IPC 7711-7721 CSE IPC J-STD-001 CSE with Space Addendum IPC J-STD-001 CSE IPC WHMA-A-620 CSE IPC-6012 CSE IPC-A-600 CSE IPC-A-610 CSE En Español IPC Specialist IPC A-610 CIS IPC A-610 CIS Recertification IPC J-STD-001 CIS IPC J-STD-001 CIS Recertification IPC J-STD-001 CIS with Space IPC 7711/7721 CIS IPC 7711/7721 CIS Recertification IPC -6012 CIS with Space IPC A-600 CIS IPC/IPC-6012 Certified IPC Specialist IPC/WHMA A-620 CIS Space IPC/WHMA-A-620 CIS Hands-On IPC/WHMA A-620 CIS Recertification IPC/WHMA A-620 CIS En Español En

Electronic Manufacturing Training Company Instructors

https://www.blackfox.com/about/instructors/

Hardware Master IPC Trainer IPC 7711/7721 Master IPC Trainer Becky also has experience and trained in the following listed below: In-Process, Final and Source Inspection TH & SM Component Identification TH & SM Soldering Rework, Repair and Modifications ESD Electronic Manufacturing Training Company Instructors Phone: (888) 837-9959 | [email protected] Store | Home | EN ES Course Calendar Course Calendar 2020 IPC Certification IPC Instructor IPC A-610 CIT IPC A-610 CIT Recertification IPC J-STD-001 CIT IPC J-STD-001 CIT Recertification IPC 7711/7721 CIT IPC 7711 /7721 CIT Recertification IPC/WHMA A-600 CIT IPC/WHMA A-600 CIT Recertification IPC/WHMA A-620 CIT IPC/WHMA A-620 CIT Recertification IPC/WHMA A-620 with HANDS-ON CIT IPC/WHMA-A-620 Space Addendum IPC J-STD-001 CIT with Space IPC J-STD-001 CIT Space ADD-ON IPC 6012 CIT En Español IPC Standards Expert IPC 7711-7721 CSE IPC J-STD-001 CSE with Space Addendum IPC J-STD-001 CSE IPC WHMA-A-620 CSE IPC-6012 CSE IPC-A-600 CSE IPC-A-610 CSE En Español IPC Specialist IPC A-610 CIS IPC A-610 CIS Recertification IPC J-STD-001 CIS IPC J-STD-001 CIS Recertification IPC J-STD-001 CIS with Space IPC 7711/7721 CIS IPC 7711/7721 CIS Recertification IPC

IPC-SpecTree2015

http://ipc.org/4.0_Knowledge/4.1_Standards/SpecTree.pdf

MATERIALS Flux/Solder J-STD-004 J-STD-005 IPC-HDBK-005 J-STD-006 J-STD-030 Adhesives IPC-SM-817 IPC-CA-821 Coat/Mask/Marking J-STD-609 IPC-CC-830 IPC-HDBK-830 IPC-SM-840 IPC-HDBK-840 IPC-HDBK-850 IPC-4781 IPC-SpecTree2015 IPC Standards Tree ACCEPTANCE IPC-DRM-PTH IPC-A-610 IPC-9191 IPC-DRM-SMT Electronics Assembly ASSEMBLY J-STD-001 IPC-HDBK-001 IPC-9261 IPC-7912 SOLDERABILITY PACKAGES IPC-SM-784 J-STD -426 IPC-TA-723 IPC-CM-770 IPC-SM-780 IPC-SM-785 IPC-S-816 IPC-AJ-820 IPC-TP-1115 IPC-1720 IPC-1756 IPC-7525 IPC-7526 IPC-7527 IPC-7530 IPC-7711/7721 IPC-7801 IPC-9701 IPC/JEDEC-9702 IPC/JEDEC-9703 IPC -026 J-STD-028 IPC-7092 IPC-7093 IPC-7094 IPC-7095 CABLE AND WIRE HARNESS IPC-DRM-WHA IPC-WHMA-A-620 CLEANING/ CLEANLINESS IPC-CH-65 IPC-9202 IPC-9203 IPC-5702 IPC-5703 IPC-5704 IPC-9201 ASSEMBLY PRINTED BOARD/ ACCEPTANCE IPC-1710 IPC-1601 IPC-4761 IPC-6011 IPC-6012 IPC-6013 IPC-6015 IPC-6016 IPC-6017 IPC-6018 IPC-9151 IPC-9194 IPC-9199 IPC-9252 IPC-9631 IPC-9641 IPC-9691 IPC-PE-740

Document Revision Table | IPC

http://ipc.org/4.0_Knowledge/4.1_Standards/revstat1.htm

and Application of Conformal Coatings 5-33c Rev A 8/13 Orig. 10/02   IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines    Orig. 4/90   IPC-SM-840 Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards  5-33b     Superseded by IPC-SM-780 Rev C – 3/88 Orig. 11/83   IPC-MP-83 IPC Policy on Metrication    Obsolete without replacement Orig. 8/85    IPC-PC-90 General Requirements for Implementation of Statistical Process Control   IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting    Orig. 3/88   IPC-SM-782 Surface Mount Design and Land Pattern Standard  1-13 Superseded by IPC-7351 Rev A Amend 2  4/99 Rev A Amend 1  10/96 Rev A 8/93 Orig. 3/87   IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation    Orig. 11/90   IPC-SM-785 Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments    Orig. 11/92   IPC-SM-786 Procedures for Characterizing and Handling and Checklist    Orig. 7/93   IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives 5-21k Rev A 12/14 Orig. 11/89   IPC-SF-818 General Requirement for Electronic Soldering Fluxes  5-24a Superseded by J-STD-004 Rev 12/91 Orig. 2/88   IPC-SP-819

Rubber X01A37008 AI Spare Parts For Panasonic RHS2B Auto Insertion Machine

http://www.smtspare-parts.com/sale-10197855-rubber-x01a37008-ai-spare-parts-for-panasonic-rhs2b-auto-insertion-machine.html

  102083700503 RATCHET LEVER   N310P9141 PHOTO SENSOR   X708250588 LEVER   N510011365AA LM GUIDE(N513HRW1-840)   X01A37008 CUSHION RUBBER   N643MBS0-117 BALL SCREW Plastic AI Parts For RHS2B Machine White Color About Us About Us Factory Tour Quality Control SMT Feeder Mechanical SMT Feeder , E00407190A0 SFN4AS JUKI Stick Feeder TYPE N4 SM421 / SM411 SM Feeder

Rubber X01A37008 AI Spare Parts For Panasonic RHS2B Auto Insertion Machine

https://www.smtspare-parts.com/sale-10197855-rubber-x01a37008-ai-spare-parts-for-panasonic-rhs2b-auto-insertion-machine.html

  102083700503 RATCHET LEVER   N310P9141 PHOTO SENSOR   X708250588 LEVER   N510011365AA LM GUIDE(N513HRW1-840)   X01A37008 CUSHION RUBBER   N643MBS0-117 BALL SCREW Plastic AI Parts For RHS2B Machine White Color About Us About Us Factory Tour Quality Control SMT Feeder Mechanical SMT Feeder , E00407190A0 SFN4AS JUKI Stick Feeder TYPE N4 SM421 / SM411 SM Feeder 8mm

00600-656

http://seikausa.com/sites/default/files/product/mcdry/mcdry-smt-magazine.pdf

(Precon- ditioning Non-IC Components). The original moisture-sensitive component document, IPC-SM- 786, Procedures for Characterizing and Handling of Moisture/Reflow Sensitive ICs, no longer is active ; and internal cracks that do not extend to the component surface. In extreme cases, cracks will extend to the component surface; in the most severe cases, the component will bulge and pop (referred to as the “popcorn” effect). The IPC — Association Con- necting Electronic Industries cre- ated and released IPC-M-109, Mois- ture-sensitive Component Standards and Guideline Manual . It includes the following seven documents: • IPC/JEDEC J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Inte- grated Circuit (IC) SMDs • IPC/JEDEC J-STD-033, Stan- dard for Handling, Packing, Shipping and Use of Moisture Reflow Sensitive SMDs • IPC/JEDEC J-STD-035, Acoustic Microscopy for Non- hermetic Encapsulated Elec- tronic Components

empfasis

http://seikausa.com/sites/default/files/product/mcdry/empf-asis-may-2001.pdf

. This document is a joint publication of the IPC and the Joint Electronic Device Engineering Council (JEDEC)1. This document was published in 1999 replacing the prior standards IPC-SM-786 and JEDEC-JESD22-A112 , wetting angle, toe, knee, and heel coverage can be measured and compared to industry standards such as IPC-A-610 “Acceptability of Electronic Assemblies.” An example of an optical micrograph used for IPC acceptability standards is shown in Figure 2 . The IPC/JEDEC standard spec- ifies a minimum dry storage time of five times the exposure time in order to re-set clock back to zero1. The most common failure due to moisture in the packages is popcorning. This failure is so named since the effect . Moisture sensitive components are one factor that adds to the complex nature of the manufacturing environment. Quality control and understanding the issues at hand are critical to minimizing this affect on your product. REFERENCES 1. IPC/JEDEC J-STD-033 , "Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Devices," IPC/JEDEC, May 1999. 2. R.L. Shook and J.P. Goodelle, "Handling of Highly Moisture-sensitive Components: An Analysis of Low-Humidity Containment and Baking Schedules

Forms and Deadlines for Registered Exhibitors | SMTA International

https://www.smta.org/smtai/exhibitor_details.cfm

 #701 Europlacer Americas  #1215 EVS International Sales Limited  #628 Fancort Industries  #840 FKN Systek  #1212 Fuji America Corporation  #523 Inovaxe Corporation  #715 InsulFab PCB Tooling  #323 Inventec Performance Chemicals USA  #1040 IPC  #747 ITW EAE  #615 JBC Tools USA Inc

Moisture Sensitive Devices (MSD) Council

https://www.smta.org/msd/msd.cfm

. Many internal procedures are based on obsolete industry standards, such as the IPC-SM-786A and JESD22-A112. These documents have been superseded by the joint IPC/JEDEC standard J-STD-033A released in 1999 and revised in July 2002. 3 . The proper storage and handling procedures during PCB assembly are clearly defined in the joint IPC/JEDEC standard J-STD-033A Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow . The table and image above were extracted from the joint IPC/JEDEC standard J-STD-033A Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices , released . The default bake cycles have been significantly increased from 24 hours to 48 hours at 125C, and from 8 days to 79 days at 40C. A table is provided in the IPC/JEDEC standard J-STD-033A to reduce the bake cycle according to the physical parameters of each

IPC APEX EXPO 2019 - Conference Brochure

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Conference-Brochure.pdf

IPC APEX EXPO 2019 - Conference Brochure ADVANCE REGISTRATION SAVINGS DEADLINE IS APPROACHING REGISTER BY DECEMBER 21 20% TECHNOLOGY’S FUTURE COMES TOGETHER SAN DIEGO CONVENTION CENTER, CA, USA MEETINGS AND COURSES: JANUARY 26 , and there’s no better place to participate in the excitement than at IPC APEX EXPO 2019. We’ve built a strong community of enthusiastic individuals passionate about electronics manufacturing , and I’m eager to work with all of you to ensure that Technology’s Future Comes Together. IPC APEX EXPO gives you the opportunity to network with your peers, to re-connect with fellow committee members, to participate in professional courses, to learn about the new technical papers . If you’re a long-time attendee of IPC APEX EXPO, welcome back. If this is your first visit, welcome to the largest tradeshow in the industry #IPCAPEXEXPO on your Twitter or Facebook feed to share your IPC APEX EXPO experience, to post photos and to continue the conversation with our social community

http://www.ipcapexexpo.org/files/IPC-APEX-EXPO-2019-Pocket-Guide.pdf

Committee V-TSL 10:00 am 12:00 pm Chair: Michael Carano, RBP Chemical Technology, Inc. 7A D-33AT IPC-6012 Training Advisory Committee D-33AT 10:00 am 12:00 pm Chair: Don Dupriest, Lockheed Martin Missiles & Fire Control 17B IPC-SM-817 SMT Adhesive Task Group /#IPCAPEXEXPO2 SCHEDULE Booth 1908 IPCAPEXEXPO.ORG FOLLOW US @IPCASSOCIATION/#IPCAPEXEXPO TECHNOLOGY’S FUTURE COMES TOGETHER 1 SCHEDULE Booth 1908 EVENT CODE TIME CHAIR/CO-CHAIR/MODERATOR ROOM SATURDAY, JANUARY 26 IPC-A-610 Task Group 7-31B 8:00 am 5:00 pm Co-chairs: Mary Muller — IPC-A-600 and IPC- 6012 Task Groups 7-31A/D- 33A 8:00 am 4:30 pm Chairs: Mark Buechner, BAE Systems; Randy Reed, R. Reed Consultancy LLC 6F J-STD-001 Task Group 5-22A 8:00 am 3:00 pm Co-chairs : Robert Cooke, NASA Johnson Space Center; Daniel Foster, Missile Defense Agency 14A Committee Chairman Council (By Invitation) CCC 4:00 pm 6:00 pm Chair: David Bergman, IPC 15A IPC Committee : Mark Wolfe, John Deere Electronic Solutions 5A IPC Hall of Fame Council Executive Forum: Automotive Electronics 7:30 am 5:00 pm Chair: Gene Weiner, Weiner International Associates 4 Show Office 8

The Last Will And Testament of the BGA Void

http://www.hellerindustries.com.cn/last-will-of-bga-void.pdf

) in accordance with the IPC- 9701 specification for tin/lead solder alloys. This temperature range is more typical of military and other high performance product use environments . A proposed BGA void requirement revision for the IPC-JSTD-001 specification will be extracted from the results analysis. BACKGROUND The subject of voids in BGA solder joints in the electronics industry was highly controversial in the late 1990s and early 2000s : IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6 between solder joint void size/location and solder joint thermal cycle integrity existed for the thermal cycle range of -55°C to +125°C; (2) derive a BGA/CSP solder joint void criteria for submission to the IPC-JSTD- 001 committee. PROCEDURES Test BGA288 19x19 mm 1.0 mm A-CABGA288- .8mm-19mm- DC Test Vehicle The test board was 2.18mm (86 mil) thick with 14 dummy inner layers. The board was constructed using FR-4 material in accordance with IPC-4101/126 with an electroless nickel/immersion gold (ENIG

Unisoft - Import Gerber, CAD, BOM, GENCAD, ODB++, Allergo, Altium Designer, etc. - PCB assembly / PC

https://www.unisoft-cim.com/importers.htm

be sample_orcad.min and sample_GENCAD.cad and these files should aid them in matching the correct file type you need. STANDARD CAD FILES: Note that many CAD systems in addition to exporting their native format may export industry standard CAD formats such as GENCAD, GENCAM, FABMASTER, IPC-D-356, IPC-2581, etc ) PCB pin x-y,netlist,trace (see note 12 / 1a) y Accel P-CAD (see note 18) IPC-D-356 .ipc/.356/varies (see note 18) PCB pin x-y,netlist (see note 18 / 1a) y Accel P-CAD (see note 13) ASCII output .PCB (see note 13 ) PCB pin x-y,netlist,trace (see note 5 / 1a) y y Altium Designer (see note 21) Altium Designer (see note 22) Altium Designer (see note 5) ODB++ IPC-2581 pin x-y list varies ) AutoCAD Electrical (see note 31) AutoTRAX DEX (see note 19) AutoTRAX DEX (see note 2) Bartels Auto Engineer (note 18) (see Eagle PCB) x-y centroid (see note 19) Gerber IPC-D-356 (see Eagle PCB) varies (see note 31) (see note 19) varies (see note 2) .ipc (note 3) Cadence-Valid Allegro (note 2) IPC-D-356 Gerber .ipc/.356 (see note 3) varies (see note 2) PCB pin x-y,netlist (see note 3 / 1a) PCB drawing file (see note 2 / 1a) y y CADint CADint (note 18) CADint (see note 26) CADint (note 2) CADSTAR (see note 17 below) GENCAD IPC-D-356 pin x-y list Gerber CADIF

Unisoft - Import Gerber, CAD, BOM, GENCAD, ODB++, Allergo, Altium Designer, etc. - PCB assembly / PC

http://www.unisoft-cim.com/importers.htm

be sample_orcad.min and sample_GENCAD.cad and these files should aid them in matching the correct file type you need. STANDARD CAD FILES: Note that many CAD systems in addition to exporting their native format may export industry standard CAD formats such as GENCAD, GENCAM, FABMASTER, IPC-D-356, IPC-2581, etc ) PCB pin x-y,netlist,trace (see note 12 / 1a) y Accel P-CAD (see note 18) IPC-D-356 .ipc/.356/varies (see note 18) PCB pin x-y,netlist (see note 18 / 1a) y Accel P-CAD (see note 13) ASCII output .PCB (see note 13 ) PCB pin x-y,netlist,trace (see note 5 / 1a) y y Altium Designer (see note 21) Altium Designer (see note 22) Altium Designer (see note 5) ODB++ IPC-2581 pin x-y list varies ) AutoCAD Electrical (see note 31) AutoTRAX DEX (see note 19) AutoTRAX DEX (see note 2) Bartels Auto Engineer (note 18) (see Eagle PCB) x-y centroid (see note 19) Gerber IPC-D-356 (see Eagle PCB) varies (see note 31) (see note 19) varies (see note 2) .ipc (note 3) Cadence-Valid Allegro (note 2) IPC-D-356 Gerber .ipc/.356 (see note 3) varies (see note 2) PCB pin x-y,netlist (see note 3 / 1a) PCB drawing file (see note 2 / 1a) y y CADint CADint (note 18) CADint (see note 26) CADint (note 2) CADSTAR (see note 17 below) GENCAD IPC-D-356 pin x-y list Gerber CADIF

Layout 1

http://www.okinternational.com/File%20Library/Metcal/Resources/Catalog/Tips-and-cartridges-selection-guide.pdf

") STTC-545 STTC-045 STTC-145 STTC-845 Conical Sharp 0.4mm x 14.7mm (.016"x .58") STTC-540 STTC-040 STTC-140 STTC-840 Conical Sharp Bent 30° Long Reach 0.4mm x 16mm (.016" x .63 4.8 (.190) 4.06 (.16) 2.8 (.110) Chip Box B EIA SOPM-4532 SMTC-503 SMTC-003 SMTC-103 4.83 (.190) 1.91 (.075) 2.03 (.080) Chip 1812 SMTC REWORK CARTRIDGES 7 SM TC R ew ork C artridges B A D Metcal Cartridges Compatible ) 10.40 (.410) 1.90 (.075) 25.9 (1.02) SOJ-40, SOM-32 SMTC REWORK CARTRIDGES 8 SM TC R ew or k C ar tr id ge s Metcal Cartridges 5 = 500 Series & 0 = 600 Series for temperature sensitive applications. 1 = 700 Series for most standard applications. 8 = 800 Square SMTC REWORK CARTRIDGES 9 Compatible with: MX-500 and MX-5000 Systems, MX-RM3E and MX-H1-AV hand-pieces All dimensions shown are in mm (inches) SM TC R ew ork C artridges B A D A2 B2 Metcal Cartridges Compatible with: MX-500 and MX-5000 Systems, MX -861 15.75mm (.62") Long SMTC-562 SMTC-062 SMTC-162 SMTC-862 22mm (.86") Long 45° 0.20" 5.0mm 0.52" 13.2mm 10 SM TC R ew or k C ar tr id ge s 11 S P E C IA LI TY Metcal Cartridges SMTC-5175 SMTC-0175 SMTC-1175 SMTC-8175 Micro Hoof 60° 0.89mm x 11.43mm

Layout 1

https://www.okinternational.com/File%20Library/Metcal/Resources/Catalog/Tips-and-cartridges-selection-guide.pdf

") STTC-545 STTC-045 STTC-145 STTC-845 Conical Sharp 0.4mm x 14.7mm (.016"x .58") STTC-540 STTC-040 STTC-140 STTC-840 Conical Sharp Bent 30° Long Reach 0.4mm x 16mm (.016" x .63 4.8 (.190) 4.06 (.16) 2.8 (.110) Chip Box B EIA SOPM-4532 SMTC-503 SMTC-003 SMTC-103 4.83 (.190) 1.91 (.075) 2.03 (.080) Chip 1812 SMTC REWORK CARTRIDGES 7 SM TC R ew ork C artridges B A D Metcal Cartridges Compatible ) 10.40 (.410) 1.90 (.075) 25.9 (1.02) SOJ-40, SOM-32 SMTC REWORK CARTRIDGES 8 SM TC R ew or k C ar tr id ge s Metcal Cartridges 5 = 500 Series & 0 = 600 Series for temperature sensitive applications. 1 = 700 Series for most standard applications. 8 = 800 Square SMTC REWORK CARTRIDGES 9 Compatible with: MX-500 and MX-5000 Systems, MX-RM3E and MX-H1-AV hand-pieces All dimensions shown are in mm (inches) SM TC R ew ork C artridges B A D A2 B2 Metcal Cartridges Compatible with: MX-500 and MX-5000 Systems, MX -861 15.75mm (.62") Long SMTC-562 SMTC-062 SMTC-162 SMTC-862 22mm (.86") Long 45° 0.20" 5.0mm 0.52" 13.2mm 10 SM TC R ew or k C ar tr id ge s 11 S P E C IA LI TY Metcal Cartridges SMTC-5175 SMTC-0175 SMTC-1175 SMTC-8175 Micro Hoof 60° 0.89mm x 11.43mm

https://qualitek.com/wp-content/uploads/2019/05/CFSI_CMRT_5.12.xlsx

in the newly published IPC-1755 Standard. Changes include: 1. Addition of new company information fields. 2. Two additional due diligence questions and removal of one. 3. Minor changes to question text throughout. 4. Expansion of instructions and definitions. 5 the CFSI CMRT with the data fields in the newly revised IPC-1755 Standard. Changes include: 1. Changes to question text throughout. 2.Expansion of instructions and definitions. 3. Updated translations of all modified text. This version incorporates numerous ://www.conflictfreesourcing.org. 4.10 CFSI CMRT Team May 12, 2017 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Smelter List Tab: Re-introduction of “smelter not yet ://www.conflictfreesourcing.org. 4.20 CFSI CMRT Team November 30, 2016 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Update to ISO short names for countries 3 List is available at: http://www.conflictfreesourcing.org/conflict-free-smelter-program/exports/cmrt-export/. 5.0 CFSI CMRT Team May 12, 2017 1. Corrections to all bugs and errors 2. Conformance to IPC-1755 in the wording of the following questions: Q. 1

https://www.kyzen.com/wp-content/uploads/2017/10/KYZEN_CFSI_CMRT5-1_20170701.xlsx

in the newly published IPC-1755 Standard. Changes include: 1. Addition of new company information fields. 2. Two additional due diligence questions and removal of one. 3. Minor changes to question text throughout. 4. Expansion of instructions and definitions. 5 the CFSI CMRT with the data fields in the newly revised IPC-1755 Standard. Changes include: 1. Changes to question text throughout. 2.Expansion of instructions and definitions. 3. Updated translations of all modified text. This version incorporates numerous ://www.conflictfreesourcing.org. 4.10 CFSI CMRT Team May 12, 2017 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Smelter List Tab: Re-introduction of “smelter not yet ://www.conflictfreesourcing.org. 4.20 CFSI CMRT Team November 30, 2016 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Update to ISO short names for countries 3 List is available at: http://www.conflictfreesourcing.org/conflict-free-smelter-program/exports/cmrt-export/. 5.0 CFSI CMRT Team May 12, 2017 1. Corrections to all bugs and errors 2. Conformance to IPC-1755 in the wording of the following questions: Q. 1

http://www.kyzen.com/wp-content/uploads/2017/10/KYZEN_CFSI_CMRT5-1_20170701.xlsx

in the newly published IPC-1755 Standard. Changes include: 1. Addition of new company information fields. 2. Two additional due diligence questions and removal of one. 3. Minor changes to question text throughout. 4. Expansion of instructions and definitions. 5 the CFSI CMRT with the data fields in the newly revised IPC-1755 Standard. Changes include: 1. Changes to question text throughout. 2.Expansion of instructions and definitions. 3. Updated translations of all modified text. This version incorporates numerous ://www.conflictfreesourcing.org. 4.10 CFSI CMRT Team May 12, 2017 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Smelter List Tab: Re-introduction of “smelter not yet ://www.conflictfreesourcing.org. 4.20 CFSI CMRT Team November 30, 2016 1. Corrections to all bugs and errors 2. Enhancements which do not conflict with IPC-1755 a. Additions and clarifications in the instructions and definitions b. Update to ISO short names for countries 3 List is available at: http://www.conflictfreesourcing.org/conflict-free-smelter-program/exports/cmrt-export/. 5.0 CFSI CMRT Team May 12, 2017 1. Corrections to all bugs and errors 2. Conformance to IPC-1755 in the wording of the following questions: Q. 1

Moisture Sensitive Devices (MSD) Council

http://smta.org/msd/msd.cfm

. Many internal procedures are based on obsolete industry standards, such as the IPC-SM-786A and JESD22-A112. These documents have been superseded by the joint IPC/JEDEC standard J-STD-033A released in 1999 and revised in July 2002. 3 . The proper storage and handling procedures during PCB assembly are clearly defined in the joint IPC/JEDEC standard J-STD-033A Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow . The table and image above were extracted from the joint IPC/JEDEC standard J-STD-033A Standard for Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface Mount Devices , released . The default bake cycles have been significantly increased from 24 hours to 48 hours at 125C, and from 8 days to 79 days at 40C. A table is provided in the IPC/JEDEC standard J-STD-033A to reduce the bake cycle according to the physical parameters of each component

http://smta.org/smtai/files/SMTAI2015-Show-Directory.pdf

www.smta.org/smtai Co-located with IPC Fall Standards Development Committee Meetings SHOW DIRECTORY 2015 SMTA International SHOW DIRECTORY >> 3 . Collaboration is vital to the success of our industry — we are honored to have the IPC join us again this year for their Fall Committee Standards Development Meetings . SMTA International and the IPC meetings provide a unique opportunity to share and learn. The SMTA International conference is highly regarded because we attract an outstanding group of international authors, speakers and volunteers . To round out the experience we are pleased to co- locate with IPC Standards Committees for the third year. We are hoping more people take advantage of participating in both events as it is guaranteed to provide a perspective no other venue can offer . . . . . . . . . . 6 General Information . . . . . . . . . 7 Sponsors . . . . . . . . . . . . . . . . . 8 IPC Meetings . . . . . . . . . . . 9-10 Special Events

http://www.gpd-global.com/co_website/pdf/doc/PCD-Pump-Parts-List-22200613.xlsx

021-0013 LINER,OUTSIDE-DIPTANK.ASSY 0 0 0 0 0 021-0014 TUBE.DRAIN-DIPTANK.ASSY 0 0 0 0 0 021-0015 TUBE,FILL 0 0 0 0 0 021-0016 TUBE,DISPERSION 0 0 0 0 0 021-0017 OBS-SEE SERVICE_COVER.TANK.ASSY 0 0 0 0 0 021-0018 TAB,MOUNT,SM-DIPTANK.ASSY 0 0 0 0 0 021

http://www.gpd-global.com/co_website/pdf/doc/NCM5000-Pump-Parts-List-22200614.xlsx

,OUTSIDE-DIPTANK.ASSY 0 0 0 0 0 021-0014 TUBE.DRAIN-DIPTANK.ASSY 0 0 0 0 0 021-0015 TUBE,FILL 0 0 0 0 0 021-0016 TUBE,DISPERSION 0 0 0 0 0 021-0017 OBS-SEE SERVICE_COVER.TANK.ASSY 0 0 0 0 0 021-0018 TAB,MOUNT,SM-DIPTANK.ASSY 0 0 0 0 0 021-0019 TAB,MOUNT,LG

*SM400SerieE 2012.07

http://islandsmt.com/wp-content/uploads/2017/02/SMART-Platform-SM400-Series.pdf

*SM400SerieE 2012.07 Samsung Techwin presents the new next generation component placer platform – the SM400 series. The SM400 series machines offer the world highest part placement capability among those of the same class by evolving the highly successful SM series machines products to large display products. It is the next generation mounter platform from component placer by enhancing the modularity and performance of existing SM series machines in order to actively respond to various market requirements for changes . Applicability to Long & Large PCBs among Those of Same Class The SM Series dual-lane conveyor system accommodates PCBs up to 250mm, increasing the overall placement speed PCBs.UL-400D Shuttle Dual Unloader 0402 Feeder 8mm 2 Pitch (SM Feeder 2P/0603 integrated) 8mm 4 Pitch (SM Feeder 4P/4E integrated) SMN Feeder SMD Configuration Diagram SAMSUNG IN-LINE SYSTEM M/G LOADER VACUUM LOADER INVERTER SCREEN PRINTER WORK STATION SHUTTLE GATE CONVEYOR VISION INSPECTION SYSTEM SHUTTLE DUAL UNLOADER Production Mode The SM43L is a high speed chip shooter optimized for LED BLU, lighting and long board based on the SM 431 platform. It reinforces the applicability to LED placement by realizing functions specific to the LED, including LED rank management

Microsoft PowerPoint - GX-37D Customer Presentation.ppt

http://islandsmt.com/wp-content/uploads/2017/05/GX-37D-Customer-Presentation1.pdf

 II Dual Beam High Speed Placement ‐One Series II Lightning Head(rear beam) ‐One Series II InLine7 Head(front beam) ‐One Magellan ULC(2.3m/p or .94m/p) ‐IPC Chip CPH: 27,500 (vs. GI‐14D: 21,700) for 1 Brd ‐IPC IC CPH: 27,500  vs. (GI‐14D: 10,500) for 1 : IPC 9850 27.5kCph37D: IPC 9850 27.5kCph title month/year 6 Base Frame •Single beam and Dual beam series size consistent with Advantis and  GSM product line •Torsionally stiff with ability to deliver 50um pitch/25 um ball flip chip  capability •Stable / 2.8 WFOV OTHC37D Part Range w/ 2.8 WFOV OTHC W FO V   01005 – 30m m  sq .25m m  pitch BG A 1005 – 55mm sq SFOV Min Bump Pitch .53mm NFOV 01005 – 12mm sq 2.8 WFOV OTHC good for: •Standard SM Applications •Consumer / Industrial /  Infrastructure title month/year 18 Genesis GXGenesis GX--37D Versatility /m sq.: 7,447(IPC Chip) • High Speed(48kcph Max) – IPC: 2.5kcph(chip)/(IC) Single Board – Typ: 23kcph(chip)/18kcph(IC) • Flexibility – 01005s up to 150mm long connectors – 25mm tall parts over 25mm tall parts – Up to 1016mm x 508 PCB Size • Odd‐form

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