Electronics Forum: ipc-tm-650 and 2.4.21.1 (Page 1 of 2)

Solder joint strength

Electronics Forum | Tue Mar 29 09:54:20 EST 2005 | chon

Indy, Please refer to IPC-TM-650 TEST METHOD MANUAL Number 2.4.21.1, this is the closest written procedure I've found and used for this. I hope helps or if someone has any other input please advise. On more thing I have this file just let me know if

Solder joint strength

Electronics Forum | Tue Mar 29 14:45:12 EST 2005 | davef

IPC-TM-650 TEST METHODS MANUAL Number 2.4.21.1 Subject: Bond Strength, Surface Mount Lands Perpendicular Pull Method 1 Scope This test method is used to determine the bond strength (breakaway strength) of surface mount lands from substrate materials

warp and twist

Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef

Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and

Bow and twist of PCB's

Electronics Forum | Fri Apr 20 13:55:09 EDT 2001 | kawiederhold

Hey Dougie, If you go to IPC.ORG and click on the on-line resources and databases, then on the "free downloads" link, the second or third document "for free" is the IPC-TM-650 in its entirety. It does discuss the test you are looking for! Have fun

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

PCB assembly bow and twist

Electronics Forum | Thu Dec 26 12:12:55 EST 2013 | igorfo

Dear Friends, I need your help to understand requirements and measurement methods for bow and twist of assembled PCB (PCBA have and SMT and TH components). I already check all posts on the site but didn't found any related to my question answers.

Bow and twist of PCB's

Electronics Forum | Fri Apr 20 07:12:22 EDT 2001 | wbu

Dougie, oh yes, it�s a bit short that chapter. I have the Revision e in front of me and this one contains in the appendix the needed IPC-TM-650 Test method for bow and twist. Can�t think that they don�t have that in the new revision. Hope you find

Bow and twist of PCB's

Electronics Forum | Mon Apr 23 14:03:18 EDT 2001 | Ryan Jennens

Dougie- We,too, have the IPC-A-600F, and the spec. refers to IPC-TM-650 test method in the back of the book. Look on page Number 2.4.22 of the test methods appendix. This outlines the procedure for determining the percentage of bow and twist,

Solder beads and wave soldering

Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds

Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.

Bow and twist of PCB's

Electronics Forum | Fri Apr 20 05:32:39 EDT 2001 | dougie

Hi, I've just splashed out �60 on IPC-A-600F trying to find out the formula for measuring the bow and twist of raw PCB's. Much to my dismay there are 10 lines on the subject in the whole standard. Worse still is that it tells me nothing I don't alre

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