Electronics Forum: ipc-tm650 (Page 1 of 15)


Electronics Forum | Jacob Lacourse |

Wed Jan 29 11:16:36 EST 2003


Electronics Forum | Wed Jul 22 08:52:29 EDT 2009 | spitkis2

Can someone clarify whether IPC-TM-650 Test Method 2.6.27 (Thermal Stress, Convection Reflow Assembly Simultation) is required for all bare board fabricators? Or is this test method optional, depending on the type or class of boards being fabricated

West coast testing labs?

Electronics Forum | Thu Mar 22 11:23:23 EST 2001 | slthomas

Any recommendations? Looking for someone that's familiar (even intimate) with the IPC-TM-650 stuff.

Anyone who has experience on IPC-TM650 environment test

Electronics Forum | Wed Nov 12 21:07:47 EST 2003 | davef

Please email us.

Ionic Contamination Tests

Electronics Forum | Tue Sep 25 17:42:11 EDT 2007 | gsala

your comments will be appreciated, please; IC tests have been performed on two kind of Raw PCBs (HASL) samples by adopting three different methods : First Sample (supllier A) - Omegameter 600 SMT, solvent=40�C: extratcing time 10 min result = 0.2

West coast testing labs?

Electronics Forum | Thu Mar 22 17:33:38 EST 2001 | davef

Steve, IPC TM-650 Test Methods Manual is a load. IPC TM-650 Test Methods Manual: Section 2.1 Visual Test Methods Section 2.2 Dimensional Test Methods Section 2.3 Chemical Test Methods Section 2.4 Mechanical Test Methods Section 2.5 Electrical Test M

force between the pad and laminate material

Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef

Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1

Ionic Contamination Tests

Electronics Forum | Tue Sep 25 20:33:02 EDT 2007 | davef

We vote for: IPC-TM-650, solvent: 80�C, extract time: 60 minutes, hold time: 30 minutes or until room temperature. Listen, it really doesn't matter which method you decide to use. IPC-TM-650 2.3.25 is a process control method. It's more imp

warp and twist

Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef

Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and

Test Coupons & Scrap Pieces for Testing Alternative to Oven Baking - IPC TM 650 2.6 2.8

Electronics Forum | Wed Sep 22 21:15:44 EDT 2021 | djenkins62

Hello Everyone: Heat Can Be Very Damaging to Boards and well as extended oven time can cut into valuable production time. Steel Camel is testing ambient temperature drying to remove diffused and embedded moisture in PCBs. We are seeking scrap pie

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