Electronics Forum | Thu Apr 05 13:40:15 EDT 2007 | slthomas
"I just need better reasons than it [...] increases defect probability." If that's not enough, you have bigger problems. Have you seen any rework/repair that was generated by this handling gem? Does your company profess to build to IPC specificati
Electronics Forum | Wed May 09 13:37:07 EDT 2007 | jmills
Greetings Tried to search past threads without an answer. I have a resistor that just fits the between pads. Some of the resisitor were installed without the termnation sitting on the pad and are infact sitting on solder a good .020 to .025 above th
Electronics Forum | Thu Sep 27 10:53:59 EDT 2007 | gregoryyork
Joris, > > Yep, very common to have those small > blow holes in lead-free alloys. We used to get > them very consistently on white-tin finished > boards, and less frequently with gold finished > boards, for what ever that is worth. > > IPC-6
Electronics Forum | Tue Jul 01 17:15:03 EDT 2008 | ronhodgson
I would like an interpretation of a solder fillet on a 5 side termination cap. (Ref: IPC-610, sec. 8.2.2.6). My question pertains to the definition of dimension F, and what constitutes the top of the fillet. Does the top of the fillet end at where
Electronics Forum | Thu Aug 14 21:58:43 EDT 2008 | proy
NO WAY I had seen this 10 years ago, and got into a 'p' match with the PCB fabricator. We had failures after wave solder, the thermal ezpansion caused cracks in the 'knee' where the skinny little trace go's over into the barrel. even if not failin
Electronics Forum | Thu Sep 17 11:19:57 EDT 2009 | jdumont
Does anyone have a reference to a spec for this? We have a tall SMT IC that we coat with AR coating in a Asymtek spray coating machine. We do not have the angle head option to spray from a 45 so the sides of tall parts are sometimes left uncovered.
Electronics Forum | Wed Mar 03 06:13:23 EST 2010 | grahamcooper22
The picture shows that the heel of the device lead is not on the pad. Either bad placement or wrong pad dimensions. I imagine most customers would reject this joint as only a small part of the lead is actually in the solder. With no heel fillet the j
Electronics Forum | Fri Mar 05 02:59:59 EST 2010 | grahamcooper22
Hi, Do you have a picture on one of these leads where the solder has covered the lead ? As this is a gull wing device I wouldn't expect solder to cover it. I expect to see a toe fillet / wetting around the sides of the lead and a heel fillet. If your
Electronics Forum | Thu Jun 27 17:32:35 EDT 2013 | tpost
We recently had a question come up regarding the amount of solder on a flat underside termination ( we referenced Flat Lug Lead in IPC 610). Judging by the photo you can see on the Left is a target solder joint, but on the right is one which had rewo
Electronics Forum | Mon Jul 29 08:34:40 EDT 2013 | gallionc
I don't see an issue. As was mentioned before, it is what the customer wants. You could approach this from one of two ways. You could simply install the parts, clinch the leads on the opposite side for added mechanical strength and solder the parts
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