Electronics Forum | Mon Jul 01 11:41:39 EDT 2013 | pbarton
Do you have access to an x-ray system? If so you can determine if the solder wetting to the lead along it's length meets the criteria set out in IPC-610. Pete B.
Electronics Forum | Tue Feb 11 11:42:06 EST 2020 | slthomas
Yep....I just looked at a copy of IPC-610-G and am not 100% sure but I think it's Note 5, Table 8-16, pg. 8-96.
Electronics Forum | Mon Jul 20 09:10:20 EDT 2020 | spoiltforchoice
I'll be honest here, while training people to IPC standards is good. Zero% of our clients or future business inquiries ask about things like IPC610, even stipulating ISO is rare, as long as there are systems in place of some sort.
Electronics Forum | Mon Aug 31 13:29:26 EDT 2020 | dwl
What exactly do you mean by component shifting? If you mean lead over hang, i.e, how far off the pad can a component lead sit and still be acceptable, IPC 610 addresses this.
Electronics Forum | Thu Apr 01 20:07:06 EDT 2021 | smith88
Is there a standard that gives criteria for cracks in Ferrite Cores? I have reviewed Jstd-oo1 G and IPC 610 G and do not see a specific reference to Ferrites. Thanks for your help
Electronics Forum | Mon Jun 19 19:08:21 EDT 2000 | Brian W.
IPC-610 Rev B: Paragraph 4.1 (page 52), As an exception to fil requirements on Table 4-1 on thermal heat sink planes plated through holes, a 50% vertical fill of solder is permitted, but with solder extending 360 degrees around the lead with 100% wet
Electronics Forum | Tue Aug 13 09:47:49 EDT 2002 | johnw
Hi Folk's, a quick and easy? question. Got a card with PTH edge stiffeners fitted to it so we need to flow solder them. Having problems getting hole fill, mainly I think due to 2 things, poor pin to hole ratio and also a bit of oxide. The question i
Electronics Forum | Tue Oct 22 15:32:09 EDT 2002 | ruppertg125
We are a military contractor and need to build to IPC610 class3. We are receiving many parts with palladium leads and currently use a No-clean solder paste. We have evaluated OA pastes with very little improvements. Without a touch up of all leads th
Electronics Forum | Thu Oct 26 11:49:54 EDT 2006 | sms_don
CW, The good news is that you are not trying to use SAC paste with SnPb balls for that would be a void generator due to the ball being liquidous while the SAC paste is still in a flux cleaning stage. Two points to consider: One, voids are not an i
Electronics Forum | Fri Jan 26 16:24:10 EST 2007 | Bob R.
Whether there's a fillet or not depends on the component type. Most have a fillet but some, such as QFN's, don't necessarily have one. Have a look at IPC-610D Workmanship Standards to understand when you should expect one and when you shouldn't. T
