Electronics Forum: irons and failure (Page 1 of 12)

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier

Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

black and grey pad

Electronics Forum | Sat Oct 06 05:33:47 EDT 2001 | spchua

I had recently encounter the "black and grey" pads problems for the BGA pad after the convection re-flow. The pads shows in in "black and grey" color and a litter solder in it, and it happen in ramdom, when applied heat and solder on the "black and g

TO99 age and reliability

Electronics Forum | Wed Jan 24 12:42:25 EST 2001 | traviss

I�m suddenly getting a very high failure rate in a TO99 component (National LM136AH-2.5). After some investigation we found some of these parts are more than 20 years old. What I am hoping for is that someone out there can help me find some standards

SAC305 and Selective Soldering

Electronics Forum | Tue Sep 17 15:40:59 EDT 2013 | 18424

Good day all, I wanted to get a quick poll from the folks running SAC305 in their selective soldering equipment. How are final results? How repeatable is the process, any machine related failures? pumps? nozzles? etc... I am just looking to get a

SAC305 and Selective Soldering

Electronics Forum | Tue Sep 17 15:47:04 EDT 2013 | 18424

Good day all, I wanted to get a quick poll from the folks running SAC305 in their selective soldering equipment. How are final results? How repeatable is the process, any machine related failures? pumps? nozzles? etc... I am just looking to get a

Dye and Pry

Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks

Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa

Dye and Pry

Electronics Forum | Wed Mar 12 23:00:10 EDT 2008 | davef

You can say: The pad was lifted after reflow and prior to the dye and pry failure analysis. When we see lifted pads, we think: * That's a good solder connection * Either it took a lot of force to lift that pad or the fabrication of the board in the

COB and wire bond

Electronics Forum | Tue Jun 04 19:33:16 EDT 2002 | rob_thomas

Dave's estimation is pretty conservative but there is a lot of equipment out there and a lot of people happy to make a sale.Implementing both mentioned processes it's difficult and time consuming .Even if you get good training from whoever sells you

Water cleaning and Moisture Entrapment

Electronics Forum | Fri Jan 02 08:10:18 EST 2009 | childs

Thanks for the reply Stephen. The time factor sounds logical for moisture invasion during cleaning, probably why there's no articles showing concern about the process. I did try experimenting with some samples and believe it or not could not dupli

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