Electronics Forum: irons failure (Page 1 of 4)

Multilayer Ceramic Capacitor (MLCC) failure root cause analysis

Electronics Forum | Mon Aug 27 04:13:49 EDT 2012 | thmeier

Moisture should not be an issue with ceramics, but mechanical or thermal stress definitely is. Has there been rework on this capacitors? So check for handling /temperature of your soldering irons (better:use hot air). Check oven temperature/profile

Cracked Capacitors

Electronics Forum | Wed Oct 31 16:56:11 EDT 2007 | glenearl

Has anyone ever looked into the possibility for laser marking 1812 size X7R ceramic chip capacitors injecting sufficient energy to cause cracking when voltage is applied? If so, what were the findings? We are having failures of caps from one manufa

Cracked Capacitors

Electronics Forum | Fri Nov 02 08:10:40 EDT 2007 | floydf

Has anyone ever looked into the possibility for > laser marking 1812 size X7R ceramic chip > capacitors injecting sufficient energy to cause > cracking when voltage is applied? If so, what > were the findings? We are having failures of > caps

Capacitor Failure

Electronics Forum | Wed Apr 26 07:56:22 EDT 2006 | davef

Since the connection improves when you touch it with a soldering iron, it indicates that the reflow recipe is NOT good. Something may have changed with the termination material requiring a higher peak temperature.

ceramic cap crack

Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef

Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron

Re: Solder Iron/Tip Problem!

Electronics Forum | Thu Jun 17 16:18:22 EDT 1999 | Earl Moon

| | Has anyone had problems with the Weller MT 1500 IRON/TIP solder station? | | Please advise your problem and resolution. | | | | ddj | | 6/16/99 | | | I don't like to use the needle tips (MT2 series), but the rest of the tips work fine. The MT2

Soldering Specification Needed

Electronics Forum | Mon Sep 26 12:58:33 EDT 2011 | action_101

So you are saying that building to class III is going to prevent failures? I disagree. Class III is trying to hit target condition in every aspect of the production of the circuit board. That my friend does not ensure failures from happening. I see

Cleaning after repair.

Electronics Forum | Thu Jan 23 14:19:56 EST 2003 | Mike Konrad

Hi Randy, No-clean flux needs to be activated in order to burn off the volatiles in the flux. This normally occurs partly during preheat and certainly during the reflow or soldering process. In most hand soldering applications, an operator applies

Good Solder Joint Failures

Electronics Forum | Mon Feb 15 15:43:06 EST 1999 | Dave Jurena

Hope some of you out there can help me with this one. I am getting feedback from our test department that they are showing opens on solder joints which have visually good wetting. The touch-up operators confirm that the joint looks good. All they do

solderability and hasl thickness

Electronics Forum | Wed Sep 10 12:56:09 EDT 2003 | davef

Intermetallic compounds [IMC]: * Form during the alloying process of some metals. In soldering these are Sn, Ni, Ag, Cu, Au. * Do not accept solder. * Increase in depth in logarithmic proportion to both time and temperature. [So during the solder

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