Electronics Forum: itf and 3 (Page 1 of 54)

NXTII M6 Generation 1 and NXT III M6 Generation 3

Electronics Forum | Wed Jul 18 21:58:38 EDT 2018 | ir11

Hi There... Sorry to post another query here but I have an existing line for pick & place machine using FUJI NXT II M6 Generation 1. We would like to add NXT modules but then the available modules that we have now is NXT III Generation 3. Is it pos

IPC Class 3 Annular Ring and Fine Pitch BGA Challenges

Electronics Forum | Wed Sep 13 03:25:43 EDT 2017 | sbar5781

Any insight appreciated!

IPC Class 3 Annular Ring and Fine Pitch BGA Challenges

Electronics Forum | Fri Sep 08 21:49:24 EDT 2017 | sbar5781

Hello, I have a few PCB boards i am trying to be manufactured that are miniaturized medical devices. Thus they require IPC Class 3 Specs. However as miniature devices they have limited space, including a 0.4mm pitch BGA socket, which currently has

IPC Class 3 Annular Ring and Fine Pitch BGA Challenges

Electronics Forum | Mon Oct 09 06:16:31 EDT 2017 | jamesbarnhart

I think you needed an IPC Class 3 annular ring because for very dense designs, the smaller the annular ring the better, as less space is taken by the pad or via and more space can be dedicated to routing the traces in highly populated areas of the bo

NXTII M6 Generation 1 and NXT III M6 Generation 3

Electronics Forum | Tue Jul 24 09:16:36 EDT 2018 | dleeper

You can't mix different Generation machines on the same base, but other than that, there shouldn't be any issue having different generation machines on the same line.

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Tue Jan 06 06:56:26 EST 2015 | stivais

How about rework (touch-up) for Class 3? Some say that you are not allowed to rework anything for Class 3. Though I have not found any proof for this 'requirement' in the standards.

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Sat Jan 10 09:04:47 EST 2015 | jandon

class 3 requires 100% barrel fill Class 3 requires 75% vertical fill of solder for component with less or more than 14 leads. Not 100% fill.

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Tue Jan 06 13:26:47 EST 2015 | rgduval

I can't say I've ever heard that you shouldn't rework class 3 products. Since class 3 and class 2 are inherently inspection standards, rework might be required to meet class 3 specs. In the past, that has been an issue, as everyone wants to produce

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Sat Jan 10 05:55:13 EST 2015 | jandon

Rework is acceptable in class 3 but hardware defects shall be documented before rework and rework shall be documented.

How to Differentiate Class 3 and Class 2 products in terms of process

Electronics Forum | Mon Dec 29 23:35:42 EST 2014 | abhilash4788

Dear All, I'm just a budding engineer in EMS field. Here we used to manufacture different classes of PCBA. I would like to know about different process that need to be considered while manufacturing class 3 product. If we are going for microscopic

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