Electronics Forum | Thu May 23 13:24:14 EDT 2013 | rgduval
We agree that it looks like a touch-up process. However, we're not certain that it would meet Class 3 requirements. It appears to be an incomplete solder joint. The outer bit of solder shows voiding to the inside bit of the solder joint, and it lo
Electronics Forum | Fri Feb 06 11:11:04 EST 2015 | mascott123
I have asked that same question to a co-chair of the J-STD-001 committee who in turn checked with personnel at IPC. The answer I received is that yes you can apply the Class 3 assembly requirements using a class 2 PWB but the resultant assembly will
Electronics Forum | Thu Jul 07 07:09:16 EDT 2016 | soldertools
BEST is an IPC Master Certification Solder Training Center offering Instructor and Operator courses for IPC-A-610, IPC J-STD-001, IPC/WHMA-620, IPC-A-600, IPC-6012 and IPC 7711/7721. BEST is also known world widely for PCB repair kits and materials t
Electronics Forum | Tue Oct 15 17:54:08 EDT 2019 | davef
From J-STD-001: Components designed for pin-in-hole application and modified for butt connection attachment, or stiff-leaded dual-inline packages (e.g., alloy 42, brazed or tempered leads) may be modified for use on Class 1 and 2 products but shall n
Electronics Forum | Thu Sep 07 15:20:58 EDT 2023 | rjroaquin6
Hello All, I recently had a case of excessive tin coming from a solder pot sample. The solder is SN63 but the results of testing had a 64.97% for Sn. The J-STD-001 spec is 61.5% to 64.5%. The pot is used to pre-tin wires which will then be solder
Electronics Forum | Wed Mar 13 13:08:31 EDT 2024 | lambert
Section 8 in the J-STD-001 was the initial place to start with cleaning and the requirements, however with all the changes going on within the industry with increase product densities and such, a revision is being created to help understand the need
Electronics Forum | Thu Mar 14 15:55:34 EDT 2024 | davef
Process Requirement Standard - J-STD-001 - Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation (test methods), frequency of testing and applicable a
Electronics Forum | Wed Nov 17 11:20:23 EST 1999 | Dave F
Hey Gyver: If you don�t mind (which you don�t have any choice about, because I�m going to do it anyhow, cause it�s MY word processor), I�m going to respond genericly, but still be directed to your question. Much of the following is paraphrased from
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
Electronics Forum | Thu Sep 17 12:08:13 EDT 1998 | Graham Naisbitt
Wayne, I think Dave and Justin are correct but I would just add my twopennworth: Your customer presumably wants to know if the end-product will be reliable? If he/she wants you to prove cleanliness, ask them for the spec they want to work to and app
