Electronics Forum | Mon Sep 29 17:31:39 EDT 2008 | davef
Q1.Does anyone know a way to verify the amount of OSP coating on a board? A1. There is no specification. Thickness is difficult to measure. Thickness is product related. There are at least six major suppliers. Years ago, here on SMTnet, J Medernach s
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
Electronics Forum | Mon Nov 02 07:32:44 EST 2009 | umar
Hi..., We have build the PCBA base on IPC 610 and J-std-001 class 3 product, All the ESD pre caution been implement at my production side, ESD flooring, wear the ESD smock, wear the ESD shoe, use the finger coat and those not use the finger coat the
Electronics Forum | Thu Nov 19 13:49:00 EST 2009 | bricke
We have been manufacturing a part using bright electrolytic tin as the finish. Our customer has been hand soldering using 63/37. They have recently switched to SN96 and have been experiencing solderability issues. We have sent samples to an outside
Electronics Forum | Fri Apr 02 12:41:12 EDT 2010 | CL
Nicolas, 4.1.2.1 and 4.1.2.2 mention the requirements for drying an MSD to resett the clock life. 4.1.2.2 states that once a component is dried, refer to 5.3 for safe storage. Under that specification is 5.3.3.2 DRY Cabinet at 5% RH- This states tha
Electronics Forum | Mon Jan 31 11:28:51 EST 2011 | krisroberson
You stated that you are producing Class 3 boards so I assume you are familiar with the IPC standards.To answer your question directly, I'll refer you back to the J-STD-001. Clause 12.1 states "12.1 Rework Hardware defects shall [N1N2D3] be documented
Electronics Forum | Thu Jul 05 11:26:08 EDT 2012 | cobham1
I need help with how long do I need to bake out double sided PCB's that have been cleaned. The units will not be reworked but instead will be moved on to hand stuffing. I have looked in IPC CH-65B and J-STD-033C. I get information for parts if I am r
Electronics Forum | Tue Dec 11 12:29:57 EST 2012 | deanm
Thanks for the comments so far. The smallest nozzle I've tried is a 4mm, which is what Pillarhouse used on this board to provide a sample. I tried this but wasn't as good as the 6mm. I've soldered the same connectors on a different board using a 10mm
