j-std 001

"j-std 001" search results in the Electronics Forums



266 results found for "j-std 001" in the Electronics Forums

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Requirements for a room with SMT equipment

Sep 20, 2017 | Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001

IPC A-610 Moving from Rev E to Rev F

Jul 24, 2017 | IPC has updated assembly standards for IPC A-610 and IPC JSTD-001 making them easier to use and addi

Humidity and temperature

Sep 15, 2016 | For current requirements: GOOGLE => J-STD-001 Revision F with Amendment 1

Inspect workmanship through conformal coating

Sep 6, 2016 | IPC J-STD-001 does not allow solder inspection to be combined with coating inspection for classes 2

IPC J-STD-001E Ionic Cleanliness Standard

Aug 30, 2013 | IPC-J-STD-001E in regards to Ionic Cleanliness standards states less than 1.56 µg/cm² of total NaCL.

Wire Tinning Pots

Oct 26, 2012 | Hello, I need to find a wire tinning pot with temp control that will conform to J-STD-001 require

Acceptance Criteria Ion Chromatography testing?

May 31, 2012 | edmaya33, you're correct about what J-STD-001E says, but recognize that the measure that you refer u

Acceptance Criteria Ion Chromatography testing?

May 31, 2012 | J-STD-001E, 8.3.6.2 states 1.56um/cm2 NaCl value.

J-STD-001E Section 4.3 Solderability

Dec 15, 2011 | Hi Joe This last sentence was not included in previous versions of J-STD-001. So, the first sente

J-STD-001E Section 4.3 Solderability

Dec 14, 2011 | Been awhile.... We are in the process of determining where are gaps are for compliance to J-STD-0

Solder Stations that meet J-STD-001 Rev E

Nov 15, 2011 | Can anyone tell me if the Metcal SP200 solder station meets the J-STD-001 Rev E requirement of holdi

Replating a Gold Connector

Dec 15, 2008 | J-STD-001 requires that solderable surfaces of components and connectors be degolded prior to solder

Information on spec on building a SMT area?

Sep 2, 2008 | ANSI-J-STD-001: * Temperature and Humidity * Lighting * Maximum noise limit * Eating, drinking,

Confused....Need Help On AS9100

Aug 7, 2008 | We expect aerospace to be IPC-A-610, Class 3 and J-STD-001, Class 3. The above quality statement

SnPb contents

Aug 4, 2008 | J-STD-001 Table 5-1 lists the allowable impurity levels for SnPb wave solder pots.

PWAs & PWB bake out requirements

Aug 11, 2007 | Tran First, you never spoke of J-001DS in your initial post. Second, J-STD-001DS requires no bak

J-STD-001 Par 4.2.2 Temperature and Humidity

Jul 16, 2007 | J-STD-001 doesn't necessarily require additional controls under conditions of low humidity, only tha

Opportunity

Jun 20, 2007 | J-STD-001, 5.4 Solderability Maintenance states words to the effect "The manufacturer shall ensure t

solder SnPb wire to gold plated IC

Apr 16, 2007 | Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder c

Solder Joint

Jan 30, 2007 | Sad part is THEY specified IPC J-STD-001C!!!

SMT Production Floor RH Control

Jan 12, 2007 | J-STD-001 makes RECOMMENDATIONS but they are not REQUIREMENTS. Only REQUIREMENT is to make sure you

SMT Production Floor RH Control

Jan 10, 2007 | ANSI-J-STD-001: 18-30*C, 30-70%RH

Your recommendation is appreciated - Humidity Range for the SMT

Nov 7, 2006 | We use J-STD-001, a widely accepted consensus document, control limits of 18-30*C, 30-70%RH. Search

PCB Assy Cleaning

Oct 2, 2006 |

LIGHTING ON THE SHOP FLOOR......

Sep 25, 2006 | 1000 Lumen per meter squared minimum per J-Std-001D 4.2.3

Contamination

Aug 13, 2006 | ANSI-J-STD-001, MIL-P-28809, MIL-STD-2000: LT 10.07 �gm/in^2 NaCl equivalent Electrochemical fail

Humidity in SMT room

Feb 17, 2006 | ANSI-J-STD-001 says words to the effect: 18-30*C, 30-70%RH

Lead Tinning J-STD Requirements

Jul 6, 2005 | Try: * A-610D, 6.3 � Wire / Lead Preparation - Tinning * J-STD-001D, [There is probably something.

Spot-On Mask (Solder Mask)

Mar 17, 2005 | J-STD-001, Appendix C, Material and Process Compatibility Testing

Ionic Contamination

Nov 11, 2004 | J-STD-001 8.4.1 Chlorine content should not exceed the following: <0.75 to 0.78 ug/cm2 for WSF

Ionic Contamination

Nov 10, 2004 | J-STD-001 8.4.1 Chlorine content should not exceed the following: <0.75 to 0.78 ug/cm2 for WSF

Ionic Contamination

Nov 10, 2004 | You can start with J-STD-001 for assemblies or IPC-6012 for Bare Boards.

How to qualify move from water wash SMT process to No clean?

Jun 24, 2004 | IPC / EIA J-STD-001-C, Appendix B

Wave Solder: Flux Validation

May 18, 2004 | J-STD-001C, Appendix B[??] discusses soldering process and material compatability testing

What standards should electronic manufacturing meet?

Mar 19, 2004 | J-STD-001 is the workmanship standard. IPC-A-610 is a guide to evaluating conformance to the standar

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