Electronics Forum | Thu Aug 22 07:48:30 EDT 2002 | Dave Milk
While separating individual pcbs from a panel, operators have caused delamination of the edge of the board, at the tabs that were cut. How can these boards be repaired? The delamination causes them to fail J-STD-001C 126.96.36.199.d. Also, what would yo
Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas
J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni
Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper
we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i
Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.
unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-
Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser
We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa
Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman
Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also
Electronics Forum | Fri Jan 07 07:36:14 EST 2005 | dansmall
I have a Polyimide board that is showing signs of de-lamination. I was wondering what pre-bake times and temperatures other people would recomend for new boards as well for boards that have been on the shelf for 8 months.
Electronics Forum | Sat Oct 03 07:26:01 EDT 2009 | cflames17
Check the reference plate on the hydra to make sure it is not cracked or delaminated. I have had problems with the glue coming loose and the plate flapping causing this same problem. check hydra camera calibrations, this to may help.
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f