Electronics Forum: j-std-001c and delamination (Page 1 of 2)

Repair of FR4 double-sided pcb

Electronics Forum | Thu Aug 22 07:48:30 EDT 2002 | Dave Milk

While separating individual pcbs from a panel, operators have caused delamination of the edge of the board, at the tabs that were cut. How can these boards be repaired? The delamination causes them to fail J-STD-001C 9.2.1.1.d. Also, what would yo

Manufacturing and test room cleanliness

Electronics Forum | Tue Jan 23 10:15:44 EST 2007 | slthomas

J-STD-001C just requires that the area not be so dirty as to contaminate your product, tools, workspace, etc. If you start counting particles, you're into cleanroom territory. Do a search on ISO 14644-1 for specifics. Actually Wikipedia does a ni

Pre-bake times and temperature for polyimide boards

Electronics Forum | Wed Jan 12 10:05:20 EST 2005 | Dreamsniper

we are using polyimide boards 6 inches x 7 inches, 2.5mm thick, 12 to 14 layers, for aerospace industries. I am using a long bake of 12 hours at 70'C prior to manufacturing or exposure to elevated reflow and wave soldering temperature. If schedule i

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

Heat guns and component damage

Electronics Forum | Tue Jan 31 13:41:12 EST 2006 | outgasser

We are currently experiencing problems with delamination during rework/2nd op activity on lead free. I am suspecting this is a result of the use of a heat gun to rework components. My assumption is that the high heat and time in area greatly increa

Dye and Pry on PoPs?

Electronics Forum | Tue Aug 16 09:37:58 EDT 2011 | blnorman

Dye and pry is frequently used on BGAs to determine if there is a crack at the board level or component level interconnect. C-SAM will show internal delaminations of components, not sure how well it would work with solder joint cracks. You can also

Pre-bake times and temperature for polyimide boards

Electronics Forum | Fri Jan 07 07:36:14 EST 2005 | dansmall

I have a Polyimide board that is showing signs of de-lamination. I was wondering what pre-bake times and temperatures other people would recomend for new boards as well for boards that have been on the shelf for 8 months.

Mydata (MY12) error-Frame Grab and Light Curtain

Electronics Forum | Sat Oct 03 07:26:01 EDT 2009 | cflames17

Check the reference plate on the hydra to make sure it is not cracked or delaminated. I have had problems with the glue coming loose and the plate flapping causing this same problem. check hydra camera calibrations, this to may help.

Processing questions - PCB and BGA's

Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep

We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f

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