Electronics Forum: j-std-002 (Page 1 of 4)

J STD 002 Test S source of ceramic substrate

Electronics Forum | Mon May 05 11:20:10 EDT 2014 | pankyb1261

Hi, I was wondering if there is a preferred source of the .635mm ceramic substrate specified in the J STD 002 Test S and if there is what is the typical size folks are using (3" x 3"?). Thanks, Rich

Solderability Specs for IC's????

Electronics Forum | Mon May 24 08:49:29 EDT 2004 | davef

ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires

Reflow issue with QFN

Electronics Forum | Thu Jul 05 20:53:58 EDT 2007 | davef

ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires

CCGA solderability criteria

Electronics Forum | Thu Jun 19 07:35:54 EDT 2008 | davef

Try: ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires

Nickel Silver Reflow Process - Specifics

Electronics Forum | Fri Feb 15 06:59:07 EST 2013 | davef

Use a standard that everyone will recognize. If you say, "The solderability test was performed in accordance with ANSI/J-STD-002 'Solderabiility Tests for Component Leads, Terminations, Lugs, Terminals and Wires'” [ipc.org/TOC/J-STD-002C.pdf ], every

solderability test

Electronics Forum | Fri Mar 01 17:03:15 EST 2002 | davef

J-STD-001 states the requirements for determining and preserving solderability. J-STD-002 defines the proper test methods and equipment.

Re: Wetting Balance Equipment

Electronics Forum | Tue Aug 11 16:49:28 EDT 1998 | Dave F

| Looking for Suppliers of surface mount wetting balance equipment. Bucky: Section 6 of the ANSI/J-STD-002 specification lists wetting balance suppliers. Dave F

BGA Solderability Standard

Electronics Forum | Tue Sep 07 16:58:16 EDT 2004 | davef

Au contraire, mon ami. Although there is not "BGA" solderability test specified in J-STD-002A, the Test S can be used to assess solderability on BGA packages. [Joint Soldering Technology Committee ]

Plating Integrity

Electronics Forum | Thu Jun 16 22:07:16 EDT 2005 | davef

Chris As you imply, testing board and component solderability prior to assembly is preferred. * ANSI/J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * ANSI/J-STD-003 - Solderability Tests for Printed Boa

MELF's falling off

Electronics Forum | Wed Oct 18 08:00:53 EDT 2006 | davef

Have you tested the solderability of the inbound components per ANSI/J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires?

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