Electronics Forum: j-std-003 (Page 1 of 4)


Electronics Forum | Tue Sep 24 13:03:51 EDT 2019 | davef

IPC-J-STD-003C: Solderability Tests for Printed Boards [ https://shop.ipc.org/IPC-J-STD-003C-WAM1-2-English-D ]


Electronics Forum | Fri Feb 15 18:51:13 EST 2013 | hegemon

My hat in the ring too, but with ALL pads showing 95% coverage or better. Slightly different interpretation! 'hege

Solderability problems with gold plated PCB's

Electronics Forum | Thu Nov 12 11:21:42 EST 2015 | davef

IPC J-STD-003. Solderability Tests for Printed Boards

Solderability test - OSP

Electronics Forum | Thu Feb 11 20:38:47 EST 2016 | davef

Try: * J-STD-003 “Solderability Tests for Printed Boards” * IPC-4555 OSP Finish Specification


Electronics Forum | Fri Feb 15 14:38:59 EST 2013 | bmario

Hi, We are having a problem with the interpretation of the surface evaluation criteria of J-STD-003 section "A minimum of 95% of each of the surfaces (i.e. each pad) being tested shall exhibit good wetting. The balance of the surface may

Re: reworking BGAs

Electronics Forum | Tue Jun 06 09:33:11 EDT 2000 | khalid

Please refer to the following document for your information. IPC/JEDEC J-STD-003. This document can be downloaded from WWW.IPC.ORG. Feel free to contact me if you have any question. Khalid.Saeed@marconi.com Regards Khalid

Solder wetting test for PCB's

Electronics Forum | Tue Apr 24 12:44:11 EDT 2001 | Steve

Take a look at J-STD-003, Solderability Tests for Printed Boards. This may help you create a procedure.

Plating Integrity

Electronics Forum | Thu Jun 16 22:07:16 EDT 2005 | davef

Chris As you imply, testing board and component solderability prior to assembly is preferred. * ANSI/J-STD-002 - Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires * ANSI/J-STD-003 - Solderability Tests for Printed Boa

Solderability test method (LF) for bare PCB brd

Electronics Forum | Mon Jan 23 20:58:08 EST 2006 | davef

J-STD-003B - Solderability Tests for Printed Boards is currently a "Working Draft". Look here: http://www.ipc.org/status.asp

Solder flow Ni/Au

Electronics Forum | Mon Mar 05 22:42:30 EST 2007 | davef

On your ENIG thickness requirements, search the fine SMTnet Archives for previous discussions, like: http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=33661 On determining if your board will solder properly: ANSI/J-STD-003, Solderability Te

  1 2 3 4 Next

j-std-003 searches for Companies, Equipment, Machines, Suppliers & Information

convection smt reflow ovens

High Precision Fluid Dispensers
2023 Eptac IPC Certification Training Schedule

World's Best Reflow Oven Customizable for Unique Applications
Fluid Dispensing Aerospace

World Source Equipment: Used equipment sale. Hundreds of items on sale.
design with ease with Win Source obselete parts and supplies

SMT Machines, Parts & Accessories - Used and New