Electronics Forum: j-std-004 (Page 1 of 4)

IPC J STD 004B Reliability tests

Electronics Forum | Fri Dec 03 04:20:18 EST 2010 | grahamcooper22

Hi In Dec 2008 the IPC J STD 004 was updated to 004B, and I am wondering what the new test conditions are for testing flux Surface Insulation Resistance and Electro Migration Potential within the new spec. I am looking for the recommended test temp

Flux evaluation

Electronics Forum | Wed Dec 29 12:27:39 EST 2010 | davef

Flux evaluation * J-STD-004, Requirements for Soldering Fluxes * IPC-A-610, Acceptability of Electronic Assemblies

"R" type solder paste

Electronics Forum | Thu May 11 11:25:56 EDT 2017 | davef

Key to Rosin Fluxes [from SUPERIOR FLUX & MFG. CO.] Type R (Rosin): Non-activated rosin flux for soldering copper. Residues are non-corrosive and non-conductive. Type RMA (Rosin Mildly Activated): Mildly activated rosin flux that contains no chlori

Paste Flux quality specification

Electronics Forum | Tue Jul 08 07:01:40 EDT 2003 | davef

Try: * ANSI/J-STD-004 - Requirements for Soldering Fluxes * ANSI/J-STD-005 - Requirements for Soldering Pastes * ANSI/J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering App

IPC J STD 004B Reliability tests

Electronics Forum | Mon Dec 20 10:20:14 EST 2010 | 18424

Test Resistance to ECM shall be 65C +- 2C @ 88.5% +- 3.5% All SIR Measurements shall not exceed 100 MOhm. I am not sure of voltage.

Re: No-Clean Solder Paste

Electronics Forum | Sun Apr 05 19:02:34 EDT 1998 | Graham Naisbitt

Peter, Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. Whatever, they do reference one another. Question: Whatparameters are used to determine "good" Solder Paste? What reference doc

Solder Paste

Electronics Forum | Thu Mar 20 10:57:28 EDT 2008 | patrickbruneel

In addition to Dave�s comments RE: Stands for RESIN (purified or modified rosin) No resin can be cleaned with pure DI water (requires saponification). L0: Stand for halide free activation which can safely be left on the boards. To my knowledge all

Soder Paste Testing

Electronics Forum | Wed Aug 30 08:59:40 EDT 2006 | saaitk

Our facility in Asia wants to change their solder paste to a local manufacturer. I have recieved specs for this paste and compared to our existing paste spec, there is not really much difference in material composition. The Asia spec tests the paste

Re: No-Clean Solder Paste

Electronics Forum | Mon Apr 06 10:32:53 EDT 1998 | Justin Medernach

Peter, Take a look at IPC-ANSI J-STD-001A and B, J-STD-004 and I think, 005/006 which cover solder paste (?) I think. Whatever, they do reference one another. Question: Whatparameters are used to determine "good" Solder Paste? What refer

Mixing no-clean solder with activated

Electronics Forum | Mon Jun 25 20:35:44 EDT 2001 | davef

According to J-STD-004 "Requirements for Soldering Fluxes", fluxes are classified by their chemical composition, activity level and halide content. In this scheme, each flux type is identified by a 4-character designator, where: * First two character

  1 2 3 4 Next

j-std-004 searches for Companies, Equipment, Machines, Suppliers & Information

MSD Dry Cabinets

Inspection mirrors for electronic rework and repair.
ZESTRON Surface Insulation Resistance

Best Reflow Oven
SMT feeders

MSD Dry Cabinets
Golden Tech Electronics

Thermal Transfer Materials.