Electronics Forum | Wed Sep 23 13:20:02 EDT 2015 | emeto
Depends on the MSL(Moisture sensitivity level) and how far you will use them in production. Here you should be able to get all the answers: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Electronics Forum | Thu Aug 26 08:54:17 EDT 1999 | Dave F
| Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | Going through datasheets wasn�t that helpfull, so does anyone know of a source for that
Electronics Forum | Thu Aug 26 10:21:22 EDT 1999 | John Thorup
| | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | Going through datasheets wasn�t that helpfull, so does anyone know of a source for
Electronics Forum | Thu Aug 26 10:49:36 EDT 1999 | Wolfgang Busko
| | | Having implemented the process of handling moisture sensitive devices our logistics department tries to classify all parts according to their moisture level. | | | Going through datasheets wasn�t that helpfull, so does anyone know of a source
Electronics Forum | Tue Jun 27 17:26:03 EDT 2000 | John Thorup
Hello Christopher You should do just fine without vacuum evacuation of the bag. Just squeeze out any excess air. Just be sure that you use active desiccant (I.E. fresh or baked). This assumes normal environmentals. I suggest that you download the
Electronics Forum | Mon Jul 10 12:39:07 EDT 2000 | Chris C
Hi Christopher, To my knowledge, heat seal along will not provide you the desire condition. Currently, we're using vacuum sealer to reseal all MSD restock items. If you have variety of package and constantly need to reseal the MSD parts, I'd like to
Electronics Forum | Tue Aug 19 11:31:43 EDT 2003 | davef
JEDEC standard EIA/JEP124 Section 5.2.1 Packing Moisture-Sensitive Components has words to the effect: "...Partially or lightly evacuate the bag to reduce packaging bulk and heat seal the bag as close to the end as possible following the heat sealing
Electronics Forum | Tue Jul 30 08:38:55 EDT 2002 | dasal
Truthfully, there are pro's and con's for both technologies. (put cost of ownership aside for one moment) Nitrogen won't dry humidified components as rapidly as a desiccant dry box. I'm talking about a self regenerating dry box that uses molecular s
Electronics Forum | Thu Sep 16 21:11:10 EDT 2004 | davef
Left to its own devices the plastic used to seal your parts will take-on moisture in the air. When you heat there parts the water in the part expands and can damage the part, if not properly demoisturized. The instustry standards for controlling su
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
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