Electronics Forum | Sat Oct 10 16:05:27 EDT 2009 | dilogic
I would if someone can share his "real-life" experience with FlexJet (7-spindle) heads. We are currently running machines with Flex heads (4-spindle), which are very easy to maintain, but I suppose 7-spindle has more throughput. All comments are welc
Electronics Forum | Fri Mar 19 10:04:51 EDT 2010 | dilogic
Thanks for the explanation - it's hard to get any information from UIC when it comes to the older equipment, so I am stucked to this forum. Can you maybe give me a hint where to ask for such conversion kit?
Electronics Forum | Tue Mar 16 06:13:58 EDT 2010 | dilogic
Can you tell me how to distinguish between them? I recently bought a second GSM2. With it I've got two FlexJet heads (dismounted). The serial number of both heads starts with FJ7P, so I assume they are of FJ7 type? The issue is - it seems that the he
Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01
There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the
Electronics Forum | Tue Sep 29 11:49:02 EDT 2015 | spoiltforchoice
Typically - hand soldering as you are currently doing. Should your volume justify it you can invest in a selective soldering solution, these might take the form of a robotic arm that essentially replicates manual soldering or a solder jet similar to
Electronics Forum | Sun Oct 11 21:19:51 EDT 2009 | fulldrawmike
we have both flexjet and flexhead, we also have the new inline 7 head on some genesis dual beams we just put into operation. If you have a choice in flexjet heads take the inline 7. The flexjet 09 head is very labor intensive, stay away from them, e
Electronics Forum | Tue Nov 01 14:46:31 EDT 2011 | davef
Agilent TestJet Technology White Paper In the early 1990s, the testing of digital parts became problematical. Previous in-circuit test techniques sought to ensure a correct, functioning part by applying digital patterns, called vectors, to the input
Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh
Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t
Electronics Forum | Tue Nov 01 13:35:29 EDT 2011 | jwanderl
With TestJet technology, if we want to test a 64 pin BGA, would we need probe access to each net of the device to get full coverage? If not, would I only get coverage to the pins that have probe access? In a nut shell, How exactly does it work?
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
