Electronics Forum: jetting (Page 16 of 31)

Info on MYDATA

Electronics Forum | Mon Apr 30 16:07:20 EDT 2007 | vlad_uk

Hey Basam, What sort of production do you have and what size boards, changeovers etc. The politics is irrelevant to the best machine for your production environment? Mydata's are not the only option and the Used market is full of good alternatives,

GSM Machines

Electronics Forum | Tue May 15 21:44:35 EDT 2007 | marcelll

The best buy you can do right now. There's a lot on the market at cheap price. Easy to find feeders & spare parts at good price. You can find a good machine for $20-25K Dont buy with FlexJet head unless your use to work with these heads. Complicated

Automatic Solder Paste Dispensers

Electronics Forum | Thu Sep 27 14:47:33 EDT 2007 | kpm135

You could try taking a look at the jet printer from MYData. http://www.mydata.com/MYWEB/Corp.nsf/$all/C7BD0068DB97D290C12571E80052A528 I have no idea about price or how well it works but it sounds like an interesting replacement for stencil printing.

Removing Markings from Devices

Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | bandjwet

All: I am interested in how process engineers are both removing and adding markings to active devices. We have a job where we have to both remove the markings of and the re-mark SOICs. The markings on the devices look like they are pad or ink jet p

Bottom side adheasive

Electronics Forum | Tue Dec 09 14:01:05 EST 2008 | evtimov

Hi Steve, first you have to decide if you need adhesive or you can go with solder. Usually depends on the TH parts. Otherwise dispensing is always more problematic process than print. I would go with the printer and stay away from troubles. It is f

Flip Chip Solder Ball Attach

Electronics Forum | Thu Aug 06 14:58:40 EDT 2009 | davef

Semiconductor fab back-ends and production contractors use laser assisted solder jetting for protoyping, repair, and other low volume flip chip bumping. * As you say, printing paste is going to be very tough to control. * Solid ball placement is ai

GSM2 and FlexJet heads

Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01

There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the

GSM2 will not zero - Theta1 following error

Electronics Forum | Tue Feb 09 08:48:29 EST 2010 | davemacnemo

Machine has 2 FlexJets installed. Working fine until it started giving Theta1 following errors. Machine will not zero. Coincidental (I think) with this, the Low Power Power Supply behind the Power Distribution Panel failed and was rebuilt. It's worki

ICT and specifying PCBA testing

Electronics Forum | Fri Mar 26 15:17:30 EDT 2010 | jooh

Thanks for your replies! So what I understand is that ICT in reality is "only" a production process safety net, but it's a net that in most practical cases is needed. What ICT can not catch is (all) bad solder joints. What are the methods to find t

ICT and specifying PCBA testing

Electronics Forum | Tue Nov 01 13:35:29 EDT 2011 | jwanderl

With TestJet technology, if we want to test a 64 pin BGA, would we need probe access to each net of the device to get full coverage? If not, would I only get coverage to the pins that have probe access? In a nut shell, How exactly does it work?


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