Electronics Forum | Sun Mar 04 01:56:37 EST 2012 | eadthem
What we have had recently is a lot of larger thin (32 thou) thickness boards that have had issues with SC90 diodes bouncing off the pads in the final PNP machine. Our setup, universal instruments GC120 or quad beam 30 spindle lightning heads. This m
Electronics Forum | Fri Jun 02 17:33:51 EDT 2000 | Dave F
Hey CK, we�re all sodder googoo�s ... wanna be gurus Why donchu tell �em not to put sodder in your vias? Er, makit so the sodder won�t flow out of the bottom of the vias and cause dem stalactites? OK OK, here�s wacha do, modify the second side ste
Electronics Forum | Fri Aug 03 05:55:25 EDT 2001 | mugen
tell ur IT guys, to stop the bulls**t!!! how u gonna write em, a ROI, when they haven't done THEIR job, of designing the system, and if em hav't design the system, how is anyone gonna know, how much money + manhours was spent, to complete the IT pro
Electronics Forum | Wed Sep 15 03:11:33 EDT 1999 | Charles Stringer
| | | Hi, | | | | | | Recently encountered missing components problem at the SMT process. | | | Among 13 chip components from the same part number mounted on the board, only 4 ( located in a same row and next to each other) were missing after post r
Electronics Forum | Thu Jul 15 14:55:24 EDT 1999 | JohnW
| I'm designing a board where the parts will only fit if I do one of the following: | | 1. Put BGAs on both sides | | 2. Put BGAs on top, smt TSOPs directly underneath and using blind vias to keep the real estate on the bottom side below the BGA pa
Electronics Forum | Wed Jul 14 11:36:56 EDT 1999 | Jimmy Strain
| | | Hi All, | | | Does any one experienced the solder on gold finger after | | | reflow. Its about 5 to 8 mils diameter . | | | We'd clean the entire screen printer, mounter & reflow as well, | | | but doesn't help much. | | | | | | | | Mr Kong..
Electronics Forum | Mon Jun 21 09:58:25 EDT 1999 | Christopher Cross
| | Now don't everyone jump on this at once, but it seems time for me to send out copies of my not even close to being dated copy of an article about HASL. Though it was published in 1992, in Printed Circuit Fabrication Magazine, and it got rave revi
Electronics Forum | Wed Apr 28 12:48:02 EDT 1999 | Justin Medernach
| | | We use Immersion Gold (AuNi) for our 20 mil pitch and BGA boards. | | | Lately, we have been having solderability problems with boards with this surface from some of our suppliers. | | | | | | We are considering trying boards with White Tin so
Electronics Forum | Sun Jan 31 03:28:24 EST 1999 | Jeff Sanchez
| Hello Netters, | | I need some info, Earl or Dave, I have a PCB that exhibits a white layer on solder side. It does not appear to be surface residues (IPA has no effect), but looks like its under solder mask. My first guess is that the LPI solde
Electronics Forum | Thu Oct 15 17:14:50 EDT 1998 | Justin Medernach
| Hi Folks, | As I travel our industry it seems to me the trend is to move from finner and finner pitch QFP's to array packages (BGA's, CSP's, etc.). Do you folks see the same trend? What is the finest pitch QFP package you have used in your process?
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