Electronics Forum: kester and lf (Page 1 of 5)

RNETs and Lead Free

Electronics Forum | Wed May 07 15:36:04 EDT 2008 | llaerum

The 483 is what we use on all boards except on one where the 353 improved wetting on resistor packs. It worked much better since the parts are LF and this is the same flux AIM uses in their LF solder. Yes, it was recommended by AIM when we discussed

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

Imm Silver and Voiding

Electronics Forum | Fri Jun 23 10:10:15 EDT 2006 | Gman

Some amount of voiding was always seen on sites where solder paste is printed. These voids are much smaller. However the site where a flip chip is flux dipped has never had problems with voiding. Macro voids (and huge ones at that)across the board s

Wave flux and profiling

Electronics Forum | Tue Dec 19 16:26:24 EST 2006 | samir

Grant, Newer lead-free fluxes have 6%-10% solids content - more activator, therefore leave more "visible" residues. Old technology tin-lead fluxes got down to as low as around the 4%-6% range (I'm going off memory, so me might be wrong)... You'll

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Wed Nov 14 03:26:38 EST 2012 | spopov

Ryan, in some cases we use 2 pastes with different melting temperature (LF SAC and PbSn)for complex boards with components on two sides. And we want to try to replace LF SAC with low melting paste.

Material Ageing and Storage

Electronics Forum | Thu Feb 22 10:32:25 EST 2001 | CAL

SCOTT- We do solderability testing for the electronics industry using a Multicore and Kester Wetting Balance testers. The standards we test to is IPC J-STD 002 for components and J-STD 003 for PCBs. There is also a system called SERA we co-developed

Nitrogen gas and Tombstone defect

Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson

N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa

paste Sn42/Bi58 and Lead Finish

Electronics Forum | Wed Nov 07 21:36:17 EST 2012 | davef

Multiple process and rework thermal cycles are brutal on boards and components. Improving reliability of products through reducing thermal stress ends-up being a major driver to the interest in lower MP LF solders. Binary LF solders require the addit

Ionic testing and No-Clean flux

Electronics Forum | Fri Feb 04 09:23:21 EST 2000 | Casimir Budzinski

If No-Clean flux does not need to be cleaned, then why do I get readings of up to 27(ug NaCl/sq in) on boards that are not washed, up to 23.4(ug NaCl/sq in) on boards washed with DI water only and from 1.2 to 10.1(ug NaCl/sq in) on boards washed with

Hand Soldering-Mixing Sn63 and L-F Processes

Electronics Forum | Tue Aug 09 06:21:19 EDT 2005 | bwet

Ladies and Gents: There have been several ways discussed in the trade press and in papers re: how to seperate/keep seperate Sn63 and l-f hand soldering tools. Some claim comepletel seperate hand soldering tools are required, while others claim that

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