Electronics Forum | Tue Nov 07 14:34:04 EST 2006 | jeffm
We are using Kester Type R520A, Alloy SN96.5/A63.0/CU.5 paste which is applied using an MPM Accuflex machine. Our plant Humidity is 38 degrees. We are seeing insufficient paste post stencil on fine pitch parts. Could this be an environment issue? In
Electronics Forum | Thu Jun 09 03:16:06 EDT 2005 | PSGill
I'm using Kester R520A Lead free solder paste. The flux % stated on the Certificate of Analysis(COA) when the product delivered to us is 10 %. The tolerance is 1%. But when i send the jar to an external lab to determine the flux % it is more than 11%
Electronics Forum | Fri Feb 05 14:39:50 EST 2010 | gregcr
Hi All, We evaluated and approved KESTER R520A for our default RoHS solder paste a couple years back. It's time to re-evaluate to see if this material is still the best choice. Please let me know your opinion on the solder paste you are using, and
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
Electronics Forum | Tue Feb 13 16:28:17 EST 2007 | rob_thomas
There are solder pastes that seem to give you less voiding. Currently we are using Kester ,water soluble paste that gives us pretty good results on BGA's up to 0.5mm pitch. Stencil design was a challenge but we are getting consistent results . Here
Electronics Forum | Wed Nov 08 08:59:54 EST 2006 | Amol Kane
well, if in the past you havent seen this issue, then something in the process has changed......as any good process engineer should do, investigate it.....new batch of paste?, expired paste?, clogged stencil?, change in programming parameters?, chang
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