Electronics Forum: key and comms (Page 1 of 5)

Dek 265 GSX motor comms failure ...

Electronics Forum | Thu Mar 22 10:11:47 EDT 2012 | menatech

if you download the mint program (maintance key switched and download via auto mode. Does is read the card correct and does it identifies the correct motor encoder?

UPS and ROHS Compliance

Electronics Forum | Fri Jan 27 09:48:26 EST 2006 | patrickbruneel

GS UPS are exempt for 2 reasons: A. Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signaling, transmission as well as network management for telecommunications. B. The primary functi

Rohs and WEEE

Electronics Forum | Sat Jan 29 08:46:20 EST 2005 | davef

The RoHS Directive complements the WEEE Directive. * Restriction of Hazardous Substances in Electrical and Electronic Equipment (RoHS) Directive [2002/95/EC] affects manufacturers, sellers, distributors and recyclers of electrical and electronic equ

Wave and Reflow Profiler

Electronics Forum | Tue Feb 19 16:19:26 EST 2008 | edatasys

Check out http://www.solderstar.co.uk/wavePro.html This tool measures all key wave solder information with a single pass. Wave/PCB contact, immersion depths, etc. Also has a reflow pack to allow use on reflow, 9 channels with predictive software. B

QFN's and LGA's

Electronics Forum | Wed May 20 17:00:56 EDT 2009 | dyoungquist

We just placed a 56 pin QFN, 1 per board, on 10 boards and had zero defects. A good paste job, proper placement and a correct oven profile are the keys. If these are set up correctly, on larger runs your defects won't be zero but they should be le

AXI and AOI

Electronics Forum | Mon Jul 08 13:49:10 EDT 2002 | msjohnston

HI, We are looking into expanding our current x-ray inspection from manually inspection one panel per lot to 100% automated inspection for all of our BGA and CSP builds. We have 100% manual inspection at the end of our SMT lines and we are consideri

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

Touch-up and Inspection Process

Electronics Forum | Thu Mar 03 09:04:26 EST 2005 | russ

Been following this thread and have a question, Why do "touch-up" people follow different criteria than "Q.C." people. It sounds like the root of the problem is not addressed but bandaids are being put into place. We have no "Q.C." department and

IP1 and SSOP28

Electronics Forum | Tue May 18 21:43:02 EDT 2010 | ashley

Hello mickd, 1) The EL data & Vision_type is NOT necessary when using MCS30 for IP1 machine. note : your input of the above might have cause confusion during VP, hence the OS error. 2) I would suggest the following... 2a) lower the Lead_check_are

SAC305 and Selective Soldering

Electronics Forum | Wed Sep 18 14:12:40 EDT 2013 | pjchonis

Hello Bachman. SAC305 is the most common lead-free solder alloy, not only for wave soldering but also selective. Most of our selective customers (especially automotive) are using SAC305. What is more important than the alloy to consider is the flux

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