Electronics Forum: kinds (Page 146 of 238)

Re: Double sided parts stuffing

Electronics Forum | Thu Nov 18 09:34:58 EST 1999 | Wolfgang Busko

Hi Will, it�s possible to use second reflow for second side components without glueing or use of different alloy solders. Although the first soldered joints become liquid during the second pass the parts will not fall off as long as their weight does

Re: Sorry, again, x,y digitizer and optical comparator

Electronics Forum | Mon Feb 18 04:49:55 EST 2002 | wbu

Hi NAMCo, I really don�t see any need in replying twice to an over 2 year old thread especially with no obvious technical content. A wrong phonenumber alone isn�t blantant and IMO no reason to open such a thread again and again ... that doesn�t help

Re: Solder Reflow Problem

Electronics Forum | Thu Nov 04 10:07:32 EST 1999 | Wolfgang Busko

Sometimes when using a new pot of paste you get one which isn�t good at all without any noticable appearance at first sight. You might try a new one. Despite the fact that you run the same profile as usual a defect of the oven of any kind unnoticed c

Re: flow thru

Electronics Forum | Sun Oct 31 08:27:09 EST 1999 | Dave F

David: I think it's great that you are getting that much barrel fill with STEEL leaded components!!! So, what kind of steel are the leads are made from? How much corrosion is on the leads? Frankly, I don't believe that the leads are made of steel

Wires UNDER BGA?

Electronics Forum | Wed Oct 20 16:05:47 EDT 1999 | Mark Charlton

I knew this would happen. Someone wants to rework a bad BGA artwork by cutting a trace and adding a wire under a 292p 1.27mm pitch PBGA. Has anyone done this before? What kind AND size wire do you use? How do you hold it in place during the replc

Re: Basics of SMT - Tutorial

Electronics Forum | Fri Sep 24 15:13:08 EDT 1999 | Bill

| | | I need to put together some quickie training material | | | for our customer service people. I've only got about 30 minutes | | | to describe the SMT process in a nutshell, so it can't be lengthy and detailed. A ppt file would be best. | | | Is

Re: Ic's sesitive to moisture

Electronics Forum | Thu Sep 23 10:28:48 EDT 1999 | Wolfgang Busko

| Hi All, | | I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. | | | thanks | | I appreci

Re: Solder Shorts Under SMT Resistors/Capacitors

Electronics Forum | Wed Sep 22 22:32:40 EDT 1999 | Dave F

| We are finding solder shorts under 1206 Components on the bottom side of our boards.In all cases these shorts are from either side of the component to a feed-thru under the component body. Adhesive is used to glue down the component and then the bo

Re: MicroBGA printing problem

Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F

| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi

Re: Solder Iron Temp.

Electronics Forum | Tue Sep 07 06:17:31 EDT 1999 | Earl Moon

| | My company is starting a prototype. The chips that will be used appear to be very sensitive. The vendor part number is Neta-40-2. | | My question is what solder temp should be used for this part? | | Any advice is appreciated. | | THX. | | | |


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