Electronics Forum | Wed Jun 24 11:59:31 EDT 1998 | Brian Conner
| What is your current solder pot temperature? Whatever that temperature is, | has it been verified/calibrated? | What kind of flux is being used? No-clean, OA, RMA? | How is the flux being applied to the PCB? | Is this problem occuring on ALL nega
Electronics Forum | Sat Jun 13 07:08:46 EDT 1998 | Dave F
| Is their an IPC standard for the water that is being used in the water wash. I have been looking and at this time have not found any thing. Steve: A lot of the old command and control specification environment has changed with the "industrializati
Electronics Forum | Wed Jun 10 13:39:56 EDT 1998 | Justin Medernach
| Our company wants to buy a rework station for BGA's. I would like to know what is a good BGA rework station. IR or hot air? Do we need a rework station with optical placement or can BGa's be placed manually during rework. We have seen a demo of an
Electronics Forum | Wed Jun 03 09:04:19 EDT 1998 | Steve Gregory
Hi Anthony! Earl's right, things can get rather involved when you start discussing ALL the things that affect whether or not a board is going to warp. The way I look at the issue is try to separate the warp issue into two catagories; 1. The board bei
Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan
| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW
Electronics Forum | Thu May 28 09:30:42 EDT 1998 | Chrys
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Mon May 11 17:35:01 EDT 1998 | Steve Gregory
On 11 May, 1998 Todd wrote: | We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does
Electronics Forum | Wed May 06 19:51:46 EDT 1998 | D.Lange
| Dear Freinds, | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOXY DI
Electronics Forum | Wed May 06 15:05:00 EDT 1998 | Justin Medernach
| | Dear Freinds, | | DOES ANY ONE OF YOU WILL BE KIND ENOUGH TO GIVE SOME INPUT ON DOUBLE SIDE REFLOW OF COMPONENTS WHAT ABOUT BOTTOM SIDE COMPONENT HOLDING DURING 2ND SIDE REFLOW? ANY IDEA OTHER THAN USING SLDERPASTE WITH OFFSET MELTING POINT, EPOX
Electronics Forum | Fri Apr 24 23:03:28 EDT 1998 | Mikec
| I inherited a DI system that's um...not in good shape. | I would be forever indebted to anyone who could help me | with several problems related to this. | Flow rate 3.5-5GPM | Incoming pressure:50PSI | Application: deionized water provided to Elec
