Electronics Forum: l and patterns and bga (Page 1 of 3)

Re: Land patterns for 0612 and 0508 capacitors

Electronics Forum | Tue Nov 30 21:23:55 EST 1999 | cklau

hello; When we are doing component land pattern design , one thing will always be in our mind; that is the basic criteria or common land pattern design guideline for reflow and flow solder assemblies. For basic fomula in calculating resistors are:

BGA assembly and inspection

Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung

Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass

BGA and Land Patterns

Electronics Forum | Tue Apr 27 12:32:53 EDT 1999 | Frank Hinojos

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank

BGA lands and ICT

Electronics Forum | Wed Mar 20 15:18:09 EST 2002 | angiewest

You may want to check out IPC-SM-782 "Surface Mount Design and Land Pattern Standard" http://www.ipc.org Good Luck

Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process

Re: BGA and Land Patterns

Electronics Forum | Tue Apr 27 13:00:05 EDT 1999 | Justin Medernach

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank Frank, Refer to the device manufacturers. they are going to have a recomme

Re: BGA and Land Patterns

Electronics Forum | Wed Apr 28 14:41:45 EDT 1999 | Bob Willis

What is the current spec for sizing PCB pads for a land grid array? How about for a ball grid array? Are there industry spec's I can reference? Thanks, Frank Frank, Refer to the device manufacturers. they are going t

Comparison between Vitech and Mirtec

Electronics Forum | Mon Jan 10 18:35:05 EST 2011 | eadthem

Ive used a Mirtec machine for 3 years MV3L with side angle inspection. Mirtec has some issues documentation, and repair plus. But there machine is impressive and the AOI software is good. We can find about 90-99.99% of all errors using just the 5

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro

Re: Re-Balling BGA and BGA sockets

Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F

Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce

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