Electronics Forum: lacks (Page 11 of 45)

Re: Looking for feedback on site performance

Electronics Forum | Wed Sep 01 17:10:25 EDT 1999 | John Thorup

| To All, | | Since Tuesday morning (EST) the SMTnet site database has been upgraded from MS Access to MS SQL. This should help reduce download time and improve our ability to handle the increasing site traffic. Have any of you noticed a change in

solder mask between qfp pads

Electronics Forum | Sat Aug 14 17:39:37 EDT 1999 | Gerry S.

One of the DFM suggestions I've seen is to remove the solder mask web, i.e. the mask between pads on 20-mil QFP devices. The rational is that if the mask is thicker than the pad the mask can prevent the stencil from making intimate contact with the

Re: Quick Frame and Dek 265GS

Electronics Forum | Wed May 20 10:00:00 EDT 1998 | EFData

The quick frame does work well with the DEK 265, but we feel that tensioning is user dependent and introduces variation into the process on an operator to operator basis. Also, because tensioning occurs only on two sides (instead of four) this also i

Re: Really?????

Electronics Forum | Fri Mar 13 08:46:05 EST 1998 | Bill

| Notice the lack of response to the laser system comment? Unspoken words can say a quite a bit...they don't want to have to address the issue. I wonder why? | Ray Ray and others: I work for Quad. Our optical centering assembly called QuadAlign doe

glue measurement

Electronics Forum | Sat Oct 06 08:36:04 EDT 2001 | davef

Your point about thermosets getting soft in the preheater of the wave is well taken. But an adhesive that is used past its expiry or other up-front lack of process control represent 99 & 44/100 percent of the reason for �glued parts falling off in

lead coalescence in solder joint

Electronics Forum | Wed Jan 30 17:47:22 EST 2002 | davef

Oooo, pix, coo!!! Yes, that solder connection has been beat-up. It is very �old�. So, your customer is seeing failures, correct? I can believe it. I want to say the solder in your connections doesn�t stand a chance, but lack experience in this a

Solder Paste Inspection System.

Electronics Forum | Fri Mar 01 04:42:13 EST 2002 | wbu

Hi Nightbull, here�s daybull speaking. Yes the same question for me, what kind of auditor was that ? What I do in an similar audit situation is simply pointing to, if existing, an obvious lack of performance in certain processes depending on my humb

dry oven

Electronics Forum | Wed Aug 14 16:30:55 EDT 2002 | sleech

Dan: Until I got deep into development of a vacuum assisted moisture removal process, I always thought that the bake process would be saddled by the lack of atmosphere in the chamber. I later learned that the conduction of temperature at reduced atm

Aqueous cleaner water disposal

Electronics Forum | Mon Sep 09 13:46:34 EDT 2002 | dragonslayr

Your lack of obvious solder balls indicates you have a decent process. However, there are still small solder balls that are free and floating on the surface of the boards prior to wash. That same solder ball is washed off and ends up in the wash solu

BGA rework systems

Electronics Forum | Fri Nov 22 12:34:14 EST 2002 | timreisenleiter

I am in the process of sourcing and ordering a BGA rework station. I only have exprerience with the OK-Industries (Now Metcal) BGA-3500 BGA rework system. Any experience/input on other comparable systems would be much appreciated (Pace TF3000, Air-


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