Electronics Forum | Mon Apr 30 18:17:16 EDT 2001 | ianlg
Hi Barry Unable to assist on specifics but I can tell you that some 74 100is machines were built. The majority residing in China Imported in by Wong King Kong Ltd ( Johnson lee Tel 00852 2357 8888 ) Most are at either Flextronics or Roslare. You mi
Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
Electronics Forum | Tue Dec 10 14:10:38 EST 2002 | Randy Villeneuve
Steve, I wave solder most if not all our boards with selective wave pallets. I did not catch if the solder balls were on top of the board or on the bottom but that will make a difference on what to do to get rid of them. Pallets are good and bad. On
Electronics Forum | Thu Nov 17 20:51:16 EST 2005 | cangly
Morning Mike, We use Pb63/Sn37, Alpha Metal alloy. Solder pot is at 250 C. The profile of board after Preheat about 100 C, Lambda Wave about 220C (use both Lambda and Chip wave), DWell time 2.1s ~ 3s. Conveyor speed 1.5 in/min. We run by bare board a
Electronics Forum | Mon Aug 13 09:49:35 EDT 2012 | rjlatz
I just got back from a visit to our PCBA manufacturer. We have good flowthrough on the PTH, but solder skips and bridges on the SMT SO IC's. We have correct orientation and robber pads, but the results are still the same. I noticed the wave shape is
Electronics Forum | Tue Sep 17 19:23:49 EDT 2024 | proy
I have a collection of Electrovert Econopak Parts I would like to sell, or find a home for. This includes - TITANIUM - nozzle/flowduct, Solder pot liner pump assembly. Also have stainless parts - we don't run a 2nd nozzle and only user the Lambda noz
Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Thu Nov 17 21:46:48 EST 2005 | C. Kolokoy
With DIP type components, a sub-par fluxing method (foaming a no-clean), and a chip wave where one is not needed are formulas for bridging and insufficient wetting. If you have SMD's on the wave solder side of the board greater than 0603, and no SOT
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