Electronics Forum | Tue Oct 24 08:07:42 EDT 2006 | markb
We are experiencing an issue with RoHS boards delaminating during SMT. In tyring to determine root cause, our board mfg house states the issue is with the laminate. The laminate supplier states that the board house is not taking the proper precua
Electronics Forum | Mon Apr 28 19:50:09 EDT 2008 | boardhouse
My guess is that either the board house did not cool the boards down properly coming out of the lamination oven. Typically after they come out of the heat chambers they go into a cool down chamber for x amount of time, if they cool to fast or are pu
Electronics Forum | Tue Apr 29 07:38:42 EDT 2008 | davef
Warpage typically (not always) kinda, sorta points to a fabrication bake induced issue that is the racking technique & may be relieved by "flat baking" under weight. Your baking at 125* won't do dip. You need to get the laminate temperature above it'
Electronics Forum | Sun Jun 07 09:01:47 EDT 2009 | davef
IPC T-50, Revision H, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, 96.2176 Pad Cratering. A separation of the pad from the printed board resin/weave composite or within the composite immediately adjacent to the pad as
Electronics Forum | Tue Mar 23 14:08:57 EDT 2010 | davef
You have what looks to be blisters/delamination. Use IPC-A-600F as a guideline for acceptance. Usually, we start from the opinion that blisters/delamination as a fabrication issue, even if it appears during solder processing. Often blisters/delam
Electronics Forum | Mon Jan 21 08:28:33 EST 2013 | proy
I am looking at assembling a relatively small baord, but it is very thin and precise. It is .010" FR4, with 1oz copper two sides. ** Components are only on one side** It has some 0201's and a .4mm pitch BGA among other leadless packages. Where
Electronics Forum | Wed Oct 19 07:04:06 EDT 2022 | winston_one
If any changes in design is not possible and you have to solder it, it's a real headache, I know... I see only 3 options here that you can try consiquently: 1) Accurately profile the board and optimize a profile (go to lower limit of process windo
Electronics Forum | Wed Jun 21 20:41:26 EDT 2000 | Dave F
Gary: Regular FR-4 will HASS. HASS has largely fallen from favor, because: * Process is difficult to control, so not to strip the life from components * Failures under HASS have nothing to do in use failures. If you insist on continuing with this,
Electronics Forum | Wed May 30 15:40:14 EDT 2001 | davef
Slappy, Most of our discussions about flex came before the last great SMTnet.com server transition that destroyed the archives. Consider custom building carriers with tooling holes, vacuum line holes, alignment pins, multiple layers, etc. from uncl
Electronics Forum | Wed Jun 20 16:03:01 EDT 2001 | Gil Zweig
The multi-layer printed circuit board manufacturers have been using x-ray inspection for many years to quality control drilling and lamination of multi-layers. Assemblers should consider using x-ray for incoming quality control from their multi-layer
