Electronics Forum: laminates (Page 21 of 48)

MPM Accuflex Calibration

Electronics Forum | Mon Jan 27 07:28:24 EST 2020 | dontfeedphils

If I'm remembering correctly, I just had a board shop I worked with supply me with a 20"x20" copper laminated piece of FR4 and used that. I believe I only used it once before I left that company, so I'm not sure how well it holds up over time.

how do I shoot a good video on my automatic CCL cutting machine line?

Electronics Forum | Fri Jul 24 03:23:34 EDT 2020 | xinyao

So I got this fully auto running machine line, that automatically pick, cut, edge grind, corner round the copper clad laminate, and I do not have a professional camara to shoot a video. How can shoot it with my phone, and still it looks amazing? Than

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul

We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba

Re: smt on flexible board

Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris

If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev

Re: Optimizing PCB for SMT

Electronics Forum | Fri Jul 16 14:34:18 EDT 1999 | Glenn Robertson

| We are converting from COB to SMT on a product line and want to optomize the PCB as far as Laminate, plating, passivation etc. This is a high temp application 150C. We are presently using BT Laminate but would like to get away from this. We are

Re: Reg: Voids in solder bumps

Electronics Forum | Thu Oct 08 14:04:04 EDT 1998 | Kris Ewen

Manish, I've seen similar phenomenon when processing CSPs on our cards. In our case, we were placing the components over the opening to in-pad blind vias. Due to poor drilling and plating processes by our board suppliers, volatiles were outgassing

Drying PCBoards

Electronics Forum | Wed Jul 03 10:32:05 EDT 2002 | davef

First, we have talked about drying / baking / demoisturizing / whatevering bare board previously. Search the fine SMTnet Archives to get started on recipes. Second and more importantly, you gotta fix this delamination problem. If it is delaminatio

How to avoid tombstoning in 0201 components

Electronics Forum | Fri Jul 29 19:12:30 EDT 2005 | Jason Fullerton

In the true sense of the term, tombstoning can only occur during reflow. Now, if your solder joints are cracking during thermal cycling and opening on one end you still have a problem - it just isn't "tombstoning". What laminate are you using on yo

non-wet on 0402 mounted on OSP & lead free paste

Electronics Forum | Fri Oct 17 22:36:35 EDT 2008 | arosario

Hi All, We just started build a new product and I am encountering many non-wet rejects in our new product. I need help on what should I look into to improve our Yield. Please see below back ground 1. We are using DEK Infinity as printer. 2. We are mo

Delamination / Measling

Electronics Forum | Mon Dec 08 17:06:59 EST 2008 | boardhouse

Hi MGL, Couple things to ask, have the boards recently been changed to Rohs builds? STD FR4 to High TD Laminate. Check the stack-up the board houses are using. Just about all Rohs laminate has Resin starvation issues when used in single ply co


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