Electronics Forum: land (Page 1 of 74)

Re: copper land delamination

Electronics Forum | Thu Nov 25 20:28:43 EST 1999 | cklau

hello, One way to prevent copper land delamination is to applied Anchoring spurs also referred to as "tie-down tabs" or "rabbit ears".These are a metal projection around a land.This features is fully captured by the cover lay (cover coat) that is n

Need a land pattern

Electronics Forum | Tue May 04 11:34:06 EDT 1999 | Ken Pishko

Need a footpint for a 10 lead uSOIC (RM-10)

copper land delamination

Electronics Forum | Mon Nov 15 14:40:38 EST 1999 | Bob Smith

Hi, I have a problem I've never seen before so I hope someone here can help. A recent batch of PCBs arrived where the copper lands delaminate with a small pull. Normally you have to pull pretty hard and the whole land comes off the substrate. These

Re: solder land analisys

Electronics Forum | Thu Jul 15 15:55:41 EDT 1999 | nards penalosa

We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec d

DPAK land pattern

Electronics Forum | Thu Mar 21 15:36:19 EST 2002 | slthomas

We're having trouble with a TO-252 DPAK from Fairchild (MC7805CDT) and our existing land pattern. The land pattern calculator on the IPC site doesn't have anything available that matches it (there are no TO-252's available on the pull downs), and I'

DPAK land pattern

Electronics Forum | Fri Mar 29 10:51:20 EST 2002 | lsmith

The IPC-EM-782 reads as follows: the adjustment factor is usually intended to increase the Z dimension slightly, but brings the Z maximum up to an even equivalent. Example if Zmax is 2.100mm then you would enter an adjustment factor of .100mm. The ad

solder land analisys

Electronics Forum | Thu Jul 15 11:57:15 EDT 1999 | nards penalosa

We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwell

Re: solder land analisys

Electronics Forum | Thu Jul 15 12:26:56 EDT 1999 | Earl Moon

We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec dwe

Re: solder land analisys

Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon

We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec

DPAK land pattern

Electronics Forum | Fri Mar 22 10:55:11 EST 2002 | slthomas

Dave, you are THE master of the search. I made the lame assumption that if they'd had layout specs. for a part, it would be part of the spec. Bad assumption. The layout for the decal from that page you linked to is exactly what I needed. I look

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