Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
Electronics Forum | Wed Mar 10 11:43:11 EST 2004 | Bill Aldeen
My name is Bill Aldeen, and I own and operate Nu-Way Electronics, Inc. We provide Tape & Reel packaging service for surface mount and through-hole electronic components. We're in the Chicago area, and we serve all of North America competitively. W
Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef
On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].
Electronics Forum | Thu May 21 08:29:05 EDT 2015 | cyber_wolf
DeanM, How do you verify you have great results with the AutoSet feature if you do not check your profiles ? How does the AutoSet take into account large ground planes on certain areas of the board ? just curious
Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon
| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind
Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm
Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate
Electronics Forum | Tue Jan 23 11:55:27 EST 2001 | aiscorp
I gather from your question that you might have experienced large scale system implementation problems in the past, or at least fear experiencing it in the future. This is a very valid concern based on the performance of traditional CIM systems. Fo
Electronics Forum | Mon Sep 10 17:52:30 EDT 2001 | mparker
Are you doing actual measurements of the dummy parts placements? or are you just doing a visual go/no go check? If doing actual measurements, be sure to use mil inch units of measure rather than mm. Mil will give you more accurate readings. mm force
Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan
Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have
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