Electronics Forum: large and area and array (Page 1 of 2)

BGA and PGA

Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef

Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P

COB and wire bond

Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate

Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.

tape and reel vendor

Electronics Forum | Wed Mar 10 11:43:11 EST 2004 | Bill Aldeen

My name is Bill Aldeen, and I own and operate Nu-Way Electronics, Inc. We provide Tape & Reel packaging service for surface mount and through-hole electronic components. We're in the Chicago area, and we serve all of North America competitively. W

CCGA and overprinting?

Electronics Forum | Mon Oct 15 10:51:49 EDT 2001 | davef

On over printing, the general issues are: * Paste deposits being so large that when reflowing, collapse onto many, rather than a single solder mass. * Paste expanding during heating and being close to other solder deposits and bridging [as you say].

Printer and Reflow Oven Recommendations

Electronics Forum | Thu May 21 08:29:05 EDT 2015 | cyber_wolf

DeanM, How do you verify you have great results with the AutoSet feature if you do not check your profiles ? How does the AutoSet take into account large ground planes on certain areas of the board ? just curious

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike Mike, We and ind

Printer and Reflow Oven Recommendations

Electronics Forum | Fri May 22 12:42:43 EDT 2015 | deanm

Sr. Tech, you are right in that there is no verification of the profile. We are a Class 3 high mix OEM. We have visual inspection after SMT. We have not seen problems with wetting, grainy solder, cold solder, charred boards, etc. that would indicate

CIM systems and Final Assembly

Electronics Forum | Tue Jan 23 11:55:27 EST 2001 | aiscorp

I gather from your question that you might have experienced large scale system implementation problems in the past, or at least fear experiencing it in the future. This is a very valid concern based on the performance of traditional CIM systems. Fo

repeatabilty and measurement for quality

Electronics Forum | Mon Sep 10 17:52:30 EDT 2001 | mparker

Are you doing actual measurements of the dummy parts placements? or are you just doing a visual go/no go check? If doing actual measurements, be sure to use mil inch units of measure rather than mm. Mil will give you more accurate readings. mm force

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

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